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LMK1D1208IRHAR

Texas Instruments

LMK1D1208IRHAR by Texas Instruments

LOW SKEW CLOCK DRIVER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; JESD-609 Code: e4;

Median Price

$11.246

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 204,120 parts In-Stock

1+ parts

$8.491

100+ parts

$7.417

1k+ parts

$5.115

10k+ parts

-

204,120

$8.491

$7.417

$5.115

-

DigiKey

USA . 2,135 parts In-Stock

1+ parts

$14.000

100+ parts

$9.496

1k+ parts

$8.684

10k+ parts

$7.821

2,135

$14.000

$9.496

$8.684

$7.821

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,982 parts In-Stock

1+ parts

$8.066

100+ parts

-

1k+ parts

-

10k+ parts

-

2,982

$8.066

-

-

-

Vyrian

USA . 1,886 parts In-Stock

1+ parts

$8.491

100+ parts

-

1k+ parts

-

10k+ parts

-

1,886

$8.491

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 103,195 parts In-Stock

1+ parts

$7.220

100+ parts

$7.040

1k+ parts

$7.003

10k+ parts

-

103,195

$7.220

$7.040

$7.003

-

Ampacity Inc.

Singapore . 103,002 parts In-Stock

1+ parts

$7.220

100+ parts

-

1k+ parts

-

10k+ parts

-

103,002

$7.220

-

-

-

Parana Technologies

USA . 2,048 parts In-Stock

1+ parts

$7.250

100+ parts

-

1k+ parts

$7.751

10k+ parts

-

2,048

$7.250

-

$7.751

-

Corphita

USA . 1,265 parts In-Stock

1+ parts

$7.642

100+ parts

-

1k+ parts

-

10k+ parts

-

1,265

$7.642

-

-

-

DigiPath Technology Company

USA . 1,091 parts In-Stock

1+ parts

$7.983

100+ parts

-

1k+ parts

-

10k+ parts

-

1,091

$7.983

-

-

-

ChromeModa Solutions

Germany . 2,802 parts In-Stock

1+ parts

$8.146

100+ parts

$6.680

1k+ parts

-

10k+ parts

-

2,802

$8.146

$6.680

-

-

IDEA Electronic Components Group

UK . 285 parts In-Stock

1+ parts

$8.146

100+ parts

-

1k+ parts

$7.331

10k+ parts

-

285

$8.146

-

$7.331

-

Corohmni

South Africa . 421 parts In-Stock

1+ parts

$8.491

100+ parts

-

1k+ parts

-

10k+ parts

-

421

$8.491

-

-

-

Technical Specifications

Clock Drivers & Buffers LMK1D1208IRHAR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

Family:

LMK

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Maximum I (ol):

3 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

40

No. of True Outputs:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

110 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.575 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

2000 MHz

Trade Compliance

LMK1D1208IRHAR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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