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DS90LV110ATMT

Texas Instruments

DS90LV110ATMT by Texas Instruments

DS90LV110ATMT clock driver by Texas Instruments has 3.9 ns propagation delay, operates at 3.3V, and offers differential input conditioning. Ideal for industrial applications requiring precise timing synchronization in a compact small outline package with 28 terminals.

Median Price

$7.200

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,715 parts In-Stock

1+ parts

-

100+ parts

$7.050

1k+ parts

$6.310

10k+ parts

$5.940

5,715

-

$7.050

$6.310

$5.940

DigiKey

USA . 5,715 parts In-Stock

1+ parts

-

100+ parts

$7.200

1k+ parts

-

10k+ parts

-

5,715

-

$7.200

-

-

Verical

USA . 5,715 parts In-Stock

1+ parts

-

100+ parts

$8.813

1k+ parts

$7.888

10k+ parts

$7.425

5,715

-

$8.813

$7.888

$7.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 861 parts In-Stock

1+ parts

$6.574

100+ parts

-

1k+ parts

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10k+ parts

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861

$6.574

-

-

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DigiKey Marketplace

USA . 5,715 parts In-Stock

1+ parts

-

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5,715

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-

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Vyrian

USA . 5,304 parts In-Stock

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5,304

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Anansix

USA . 1,858 parts In-Stock

1+ parts

-

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1,858

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-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

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-

-

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Prism Electronics

USA . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,523 parts In-Stock

1+ parts

$5.880

100+ parts

-

1k+ parts

-

10k+ parts

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5,523

$5.880

-

-

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Corphita

USA . 3,830 parts In-Stock

1+ parts

$6.228

100+ parts

-

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3,830

$6.228

-

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Microchip USA

USA . 361 parts In-Stock

1+ parts

$21.530

100+ parts

$21.380

1k+ parts

$21.380

10k+ parts

$21.220

361

$21.530

$21.380

$21.380

$21.220

Parana Technologies

USA . 1,281 parts In-Stock

1+ parts

$23.397

100+ parts

-

1k+ parts

$24.030

10k+ parts

-

1,281

$23.397

-

$24.030

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IDEA Electronic Components Group

UK . 433 parts In-Stock

1+ parts

$26.289

100+ parts

$24.975

1k+ parts

$23.660

10k+ parts

-

433

$26.289

$24.975

$23.660

-

ChromeModa Solutions

Germany . 318 parts In-Stock

1+ parts

$26.289

100+ parts

$21.557

1k+ parts

-

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318

$26.289

$21.557

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$32.871

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238

$32.871

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Continental Prestige Electronics

USA . 4,737 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Kepictronics

USA . 2,200 parts In-Stock

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2,200

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Argo Parts USA

USA . 1,585 parts In-Stock

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1,585

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Alle Elektronik GmbH

Germany . 1,310 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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DigiPath Technology Company

USA . 112 parts In-Stock

1+ parts

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$23.702

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112

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$23.702

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Perfect Parts

USA . 112 parts In-Stock

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112

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A-Z Elektronik GmbH

Germany . 110 parts In-Stock

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110

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Overview

Enhance your electronic designs with the reliable DS90LV110ATMT clock driver and buffer by Texas Instruments. With a reputation for delivering high-quality components, Texas Instruments ensures that this product exceeds industry standards. Ideal for various applications in the clock drivers & buffers category, this component boasts a low propagation delay, differential input conditioning, and 3-state output characteristics. Customers can trust in the value, benefits, and advantages that the DS90LV110ATMT offers, making it an essential choice for any project requiring precision timing and signal distribution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures efficient performance of the clock drivers and buffers.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 3.3

Matches standard supply voltage, making it compatible with various systems.

Load Capacitance (CL): 5 pF

Low load capacitance ensures fast signal transmission.

Output Characteristics: 3-STATE

3-state output allows for high flexibility and control over the output signal.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environments with low temperatures.

Terminal Pitch: 0.65 mm

Compact terminal pitch enables high density mounting on PCBs.

Technical Specifications

Clock Drivers & Buffers DS90LV110ATMT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

90LV

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.091 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

4.4 mm

Trade Compliance

DS90LV110ATMT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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