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DS90LV110ATMTX/NOPB

Texas Instruments

DS90LV110ATMTX/NOPB by Texas Instruments

DS90LV110ATMTX/NOPB clock driver by Texas Instruments has 3.9 ns propagation delay at 3.3V, suitable for industrial applications. With 28 terminals and differential input conditioning, it offers 20 true outputs with a load capacitance of 5 pF. This surface-mount device operates b/w -40 to 85°C, making it ideal for high-speed communication systems.

Median Price

$5.290

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 34,707 parts In-Stock

1+ parts

$5.930

100+ parts

$4.835

1k+ parts

$3.223

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-

34,707

$5.930

$4.835

$3.223

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Rochester

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$4.650

1k+ parts

$4.160

10k+ parts

$3.910

17

-

$4.650

$4.160

$3.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$3.223

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-

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98

$3.223

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Digiode

USA . 3,253 parts In-Stock

1+ parts

$4.256

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3,253

$4.256

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Vyrian

USA . 16,895 parts In-Stock

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16,895

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Anansix

USA . 1,992 parts In-Stock

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1,992

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ACDS - Activité Composants Distribution Service

France . 292 parts In-Stock

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292

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Distributors (Availability)

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.159

100+ parts

-

1k+ parts

$3.032

10k+ parts

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500

$3.159

-

$3.032

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Continental Prestige Electronics

USA . 2,959 parts In-Stock

1+ parts

$3.223

100+ parts

-

1k+ parts

-

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$3.159

2,959

$3.223

-

-

$3.159

Argo Parts USA

USA . 2,421 parts In-Stock

1+ parts

$3.223

100+ parts

-

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2,421

$3.223

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Ampacity Inc.

Singapore . 17,266 parts In-Stock

1+ parts

$3.810

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17,266

$3.810

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Corphita

USA . 2,338 parts In-Stock

1+ parts

$4.032

100+ parts

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2,338

$4.032

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Andel Nordic

Denmark . 4,210 parts In-Stock

1+ parts

$4.350

100+ parts

-

1k+ parts

$4.176

10k+ parts

$4.176

4,210

$4.350

-

$4.176

$4.176

Parana Technologies

USA . 1,219 parts In-Stock

1+ parts

$22.730

100+ parts

-

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$23.394

10k+ parts

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1,219

$22.730

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$23.394

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DigiPath Technology Company

USA . 683 parts In-Stock

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$25.028

100+ parts

$23.026

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683

$25.028

$23.026

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ChromeModa Solutions

Germany . 6,926 parts In-Stock

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$25.539

100+ parts

$20.942

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6,926

$25.539

$20.942

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IDEA Electronic Components Group

UK . 1,368 parts In-Stock

1+ parts

$25.539

100+ parts

$24.262

1k+ parts

$22.985

10k+ parts

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1,368

$25.539

$24.262

$22.985

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QUARKTWIN TECHNOLOGY LTD

USA . 28,578 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,637 parts In-Stock

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2,637

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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iodParts Technologies Inc.

India . 109 parts In-Stock

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$7.980

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109

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$7.980

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Overview

Unlock the power of precision with the DS90LV110ATMTX/NOPB by Texas Instruments. Crafted with quality materials and advanced technology, this clock driver offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product provides reliable signal conditioning and fast propagation delay, ensuring seamless operation in any environment. Trust Texas Instruments to deliver excellence, choose the DS90LV110ATMTX/NOPB for all your clock driver needs and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 3.9 ns

The low propagation delay ensures fast signal transmission, making this clock driver suitable for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, resulting in more reliable performance.

Nominal Supply Voltage / Vsup (V): 3.3

The consistent supply voltage of 3.3V ensures stable operation and compatibility with various electronic systems.

Load Capacitance (CL): 5 pF

The low load capacitance minimizes signal distortion and interference, leading to accurate clock synchronization.

Power Supplies (V): 3.3

The 3.3V power supply support is common in many electronic devices, making this clock driver versatile and widely applicable.

No. of Terminals: 28

The ample number of terminals allow for multiple connections and diverse integration possibilities, catering to various system designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB, making it ideal for compact electronic devices with limited board real estate.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this clock driver can withstand harsh environmental conditions and maintain performance reliability.

Output Characteristics: 3-STATE

The 3-state output feature allows for flexibility in signal routing, enabling efficient control and management of the output signal.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold or freezer environments, making it suitable for diverse applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and corrosion resistance, enhancing the overall reliability and longevity of the clock driver.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting orientations, offering flexibility in PCB layout and design.

Maximum Seated Height: 1.2 mm

The low seated height enables a compact design and efficient use of vertical space, making it suitable for slim and space-constrained electronic devices.

Width: 4.4 mm

The narrow width of 4.4mm contributes to a compact footprint on the PCB, facilitating dense and efficient circuit layouts.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources, enhancing the versatility of the clock driver.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature allows for reliable soldering and assembly processes, ensuring durability and robustness.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables secure and efficient soldering of the clock driver during assembly, ensuring quality connections.

Length: 9.7 mm

The compact length of 9.7mm contributes to a space-saving design, ideal for applications with size constraints or compact layout requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions, making it suitable for rugged applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable connectivity during PCB assembly, ensuring a secure connection and stable performance.

Packing Method: TR

The TR packing method provides secure and organized packaging for transportation and storage, protecting the clock driver from damage or mishandling.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for precise and compact terminal spacing, enabling high-density PCB layouts and efficient signal routing.

Maximum Same Edge Skew (tskwd): 0.091 ns

The low same edge skew of 0.091ns ensures accurate signal timing alignment, reducing signal interference and improving synchronization in multi-channel applications.

No. of True Outputs: 20

The 20 true outputs provide ample signal processing capabilities, allowing for diverse output configurations and efficient signal distribution.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates low susceptibility to moisture-related damage, ensuring durability and reliability in humid or damp environments.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage support of 3.6V provides a safety margin for voltage fluctuations, enhancing the overall robustness and reliability of the clock driver.

Maximum Power Supply Current (ICC): 160 mA

The high maximum power supply current of 160mA allows for efficient power delivery and stable operation, supporting reliable performance in demanding applications.

Technical Specifications

Clock Drivers & Buffers DS90LV110ATMTX/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

90LV

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.091 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

DS90LV110ATMTX/NOPB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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