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DS90LV110TMTCX/NOPB

Texas Instruments

DS90LV110TMTCX/NOPB by Texas Instruments

DS90LV110TMTCX/NOPB by Texas Instruments is a Clock Driver & Buffer with 3.6 ns Propagation Delay, 3.3V Nominal Voltage, and 28 Terminals. It is used in industrial applications requiring differential input conditioning and 3-STATE output characteristics. The package style is small outline with thin profile, suitable for surface mount assembly.

Median Price

$5.503

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 108,421 parts In-Stock

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$5.503

100+ parts

$4.487

1k+ parts

$2.991

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108,421

$5.503

$4.487

$2.991

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$2.991

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$2.991

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Digiode

USA . 5,334 parts In-Stock

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$5.228

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5,334

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Vyrian

USA . 108,075 parts In-Stock

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Chip Stock

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14,519

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ComSIT Distribution GmbH

Germany . 4,290 parts In-Stock

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Anansix

USA . 786 parts In-Stock

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Semtec, LLC

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,763 parts In-Stock

1+ parts

$2.991

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$2.931

4,763

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$2.931

Argo Parts USA

USA . 545 parts In-Stock

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$2.991

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545

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Ampacity Inc.

Singapore . 108,305 parts In-Stock

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$4.680

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Corphita

USA . 5,158 parts In-Stock

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$4.953

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Parana Technologies

USA . 1,590 parts In-Stock

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$14.014

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$14.484

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DigiPath Technology Company

USA . 968 parts In-Stock

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$15.431

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ChromeModa Solutions

Germany . 6,017 parts In-Stock

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$15.746

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$12.912

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

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$15.746

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$14.959

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Corohmni

South Africa . 143 parts In-Stock

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Perfect Parts

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Lixinc

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Alle Elektronik GmbH

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Glotronic Ltd.

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Authorized Procurement Solutions

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Kepictronics

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Andel Nordic

Denmark . 952 parts In-Stock

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GreenTree Electronics

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Speed Components Ltd (Excess)

Israel . 5 parts In-Stock

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Overview

Upgrade your clock driver and buffer needs with the DS90LV110TMTCX/NOPB by Texas Instruments. This industrial-grade product offers exceptional quality and reliability, providing a wide range of applications for differential input conditioning. With its compact and durable design, this clock driver boasts a low propagation delay of 3.6 ns, ensuring optimal performance in various settings. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, offering customers unparalleled value and benefits. Elevate your projects with the DS90LV110TMTCX/NOPB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, which is ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 3.6 ns

Low propagation delay ensures fast and efficient operation of the clock drivers and buffers.

Surface Mount: YES

Surface mount capability simplifies the manufacturing process and allows for compact design of the final product.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, ensuring reliable signal reception.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V facilitates integration with other components in the system.

Load Capacitance (CL): 5 pF

Low load capacitance minimizes the impact on signal integrity, allowing for efficient signal transmission.

Power Supplies (V): 3.3

Matching power supply voltage helps in achieving proper functionality and compatibility within the system.

No. of Terminals: 28

Having a sufficient number of terminals enables versatile connectivity options in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile and shrink pitch saves PCB space and enhances overall design flexibility.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Output Characteristics: 3-STATE

3-state output capability allows for efficient control of signal flow, enhancing the versatility of the device.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures operational reliability in harsh cold environments.

Technical Specifications

Clock Drivers & Buffers DS90LV110TMTCX/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

90LV

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

195 mA

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.091 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

DS90LV110TMTCX/NOPB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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