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CDCVF2310PWRG4

Texas Instruments

CDCVF2310PWRG4 by Texas Instruments

CDCVF2310PWRG4 by Texas Instruments is a clock driver with 3.5 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 2.5V and has 24 terminals in a small outline package style. With 10 true outputs and max fmax of 200 MHz, it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Chip Stock

USA . 63,600 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 1,672 parts In-Stock

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Digiode

USA . 1,328 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 829 parts In-Stock

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Nova Conductors

Japan . 40 parts In-Stock

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Electronic Treasures

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Distributors (Availability)

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Andel Nordic

Denmark . 2,988 parts In-Stock

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$1.170

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$1.123

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$1.123

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AZTECH Wire

Italy . 317 parts In-Stock

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$6.252

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Ampacity Inc.

Singapore . 555 parts In-Stock

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$24.000

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Parana Technologies

USA . 2,331 parts In-Stock

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$28.144

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$44.182

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DigiPath Technology Company

USA . 1,575 parts In-Stock

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$30.991

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$28.511

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ChromeModa Solutions

Germany . 3,987 parts In-Stock

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$31.623

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$25.931

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IDEA Electronic Components Group

UK . 1,562 parts In-Stock

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$31.623

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$30.042

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$28.461

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Corohmni

South Africa . 73 parts In-Stock

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One Stop Electronics

USA . 906 parts In-Stock

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Lixinc

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Kepictronics

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Speed Components Ltd (Excess)

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Corphita

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Bastille Electronics

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Overview

Elevate your design with the CDCVF2310PWRG4 by Texas Instruments, a clock driver and buffer that offers precision and reliability. Manufactured by industry leader Texas Instruments, this product is ideal for a wide range of applications. With fast propagation delay and 3-state output characteristics, this device provides seamless performance in industrial-grade conditions. Trust in the quality and value of Texas Instruments as you enhance your projects with the CDCVF2310PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring it can withstand varying environmental conditions.

Propagation Delay At Nominal Supply: 3.5 ns

Low propagation delay ensures fast signal transmission and precise clock synchronization, making it suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, making it compatible with a wide range of systems and applications.

Maximum I (ol): 12 Amp

High output current capability ensures reliable performance and the ability to drive multiple loads without signal degradation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the clock driver to function effectively in extreme cold conditions, enhancing its versatility.

Maximum Supply Voltage (Vsup): 3.6 V

Can operate at higher supply voltages, providing flexibility in design and compatibility with different power sources.

Technical Specifications

Clock Drivers & Buffers CDCVF2310PWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.17 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

200 MHz

Trade Compliance

CDCVF2310PWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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