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CDCVF2505D

Texas Instruments

CDCVF2505D by Texas Instruments

Texas Instruments CDCVF2505D clock driver has 0.15 ns propagation delay, 3.3V supply voltage, and 25 pF load capacitance. Ideal for industrial applications requiring precise timing in a small outline package with surface mount capability.

Median Price

$2.652

Lifecycle Status

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25

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1k+

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Chip1Stop

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Texas Instruments

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$2.448

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DigiKey

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$4.240

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$2.719

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$2.315

310

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$2.315

Mouser Electronics

USA . 271 parts In-Stock

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Arrow

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Verical

USA . 156 parts In-Stock

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$0.923

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$0.915

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$1.413

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Nova Conductors

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Digiode

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Component Electronics Inc.

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$3.850

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$2.880

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$2.500

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Chip Stock

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Vyrian

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Prism Electronics

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TME

Poland . 975 parts In-Stock

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Component Sense

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ACDS - Activité Composants Distribution Service

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Elcom Components

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Mil-Aero Solutions, Inc.

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Inventory MP

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Bristol Electronics

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LWI Electronics Inc

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Atlantic Semiconductor

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Semi Source

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NexGen Digital

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Ampacity Inc.

Singapore . 5,340 parts In-Stock

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$1.810

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Aranea Global

USA . 1,000 parts In-Stock

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$1.951

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$1.873

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$1.951

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Continental Prestige Electronics

USA . 6,752 parts In-Stock

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$1.991

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$1.951

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Argo Parts USA

USA . 3,372 parts In-Stock

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$1.991

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Corphita

USA . 1,702 parts In-Stock

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$2.106

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Andel Nordic

Denmark . 1,978 parts In-Stock

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$2.310

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$2.218

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Semicontronic

India . 5,202 parts In-Stock

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$3.930

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$3.832

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$3.812

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Parana Technologies

USA . 861 parts In-Stock

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$16.109

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$16.437

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DigiPath Technology Company

USA . 1,453 parts In-Stock

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$17.738

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$16.319

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ChromeModa Solutions

Germany . 2,969 parts In-Stock

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$18.100

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$14.842

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IDEA Electronic Components Group

UK . 2,231 parts In-Stock

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$18.100

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$17.195

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Corohmni

South Africa . 134 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Perfect Parts

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,568 parts In-Stock

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Alle Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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GreenTree Electronics

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Overview

Unleash the power of precision timing with the CDCVF2505D by Texas Instruments, a clock driver and buffer that sets the standard for quality and reliability in electronic components. With advanced features like fast propagation delay and 3-state output characteristics, this product is perfect for a wide range of applications. From industrial automation to telecommunications, the CDCVF2505D delivers unmatched performance and efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the CDCVF2505D and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the clock driver, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 3.3

Compatibility with a commonly used supply voltage of 3.3V makes this clock driver versatile and suitable for a wide range of applications.

Maximum I (ol): 12 Amp

High output current capability allows the clock driver to drive multiple loads or components without the need for additional buffer circuits.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the clock driver to function reliably in harsh environmental conditions, making it suitable for industrial applications.

Maximum Same Edge Skew (tskwd): 0.15 ns

Low skew ensures that all outputs switch simultaneously, preventing timing errors and improving the overall performance of the clock driver.

No. of True Outputs: 4

Multiple true outputs provide flexibility in driving multiple components or signals, making this clock driver suitable for complex circuit designs.

Minimum fmax: 200 MHz

High maximum frequency capability allows the clock driver to support fast data rates, making it ideal for applications requiring high-speed signal processing.

Technical Specifications

Clock Drivers & Buffers CDCVF2505D attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2505

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

200 MHz

Trade Compliance

CDCVF2505D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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