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CDCV855IPWRG4

Texas Instruments

CDCV855IPWRG4 by Texas Instruments

CDCV855IPWRG4 by Texas Instruments is a clock driver with 28 terminals, operating at 2.5V. It features a propagation delay of 4.5ns and supports differential input conditioning. With a package size of 9.7mm x 4.4mm, it is ideal for industrial applications requiring precise timing control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,298 parts In-Stock

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Digiode

USA . 1,586 parts In-Stock

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1,586

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Connector Distribution Corp

USA . 30 parts In-Stock

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30

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Right Parts Inc.

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$5.079

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625

$5.079

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Parana Technologies

USA . 1,758 parts In-Stock

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$19.139

100+ parts

$1,777.306

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$17.225

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1,758

$19.139

$1,777.306

$17.225

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DigiPath Technology Company

USA . 1,545 parts In-Stock

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$21.074

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$19.388

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1,545

$21.074

$19.388

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ChromeModa Solutions

Germany . 1,755 parts In-Stock

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$21.504

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$17.633

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$21.504

$17.633

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IDEA Electronic Components Group

UK . 166 parts In-Stock

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$21.504

100+ parts

$20.429

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$19.354

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166

$21.504

$20.429

$19.354

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One Stop Electronics

USA . 284 parts In-Stock

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$58.000

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284

$58.000

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Component Stockers USA

USA . 315 parts In-Stock

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$99.990

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Microchip USA

USA . 2,340 parts In-Stock

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Corphita

USA . 903 parts In-Stock

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Kepictronics

USA . 550 parts In-Stock

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Northwest PG Solutions

USA . 547 parts In-Stock

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$3.449

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547

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$3.449

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Native Components

USA . 418 parts In-Stock

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$3.413

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418

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$3.413

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Overview

Enhance your electronic designs with the high-quality CDCV855IPWRG4 Clock Driver & Buffer by Texas Instruments. This versatile component offers superior performance and reliability, making it a top choice for a wide range of applications. From data communication to industrial automation, this clock driver ensures precise timing and synchronization. Trust in Texas Instruments' reputation for excellence and unlock the value and benefits that this product brings to your projects. Upgrade your designs today with the CDCV855IPWRG4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the components inside, making the product durable and reliable.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise interference and improving signal integrity, ensuring accurate clock signal transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Having a 2.5V nominal supply voltage makes it compatible with a wide range of systems and ensures stable operation.

Maximum I (ol): 12 Amp

High output current capability of 12A allows for driving multiple loads without compromising performance.

Propagation Delay (tpd): 4.5 ns

Low propagation delay of 4.5ns ensures fast clock signal transmission, suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range of -40 to 85°C ensures reliable operation in harsh environmental conditions.

Technical Specifications

Clock Drivers & Buffers CDCV855IPWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

855

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

14 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

180 MHz

Trade Compliance

CDCV855IPWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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