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ZL40222LDF1

Microchip Technology

ZL40222LDF1 by Microchip Technology

ZL40222LDF1 clock driver by Microchip operates at 2.5V, with a propagation delay of 2ns. It features 16 true outputs and is ideal for industrial applications requiring differential mux input conditioning in a compact square package.

Median Price

$9.219

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$9.219

100+ parts

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650

$9.219

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Vyrian

USA . 1,328 parts In-Stock

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1,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$4.955

100+ parts

-

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652

$4.955

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Andel Nordic

Denmark . 909 parts In-Stock

1+ parts

$8.947

100+ parts

-

1k+ parts

$8.589

10k+ parts

$8.589

909

$8.947

-

$8.589

$8.589

Continental Prestige Electronics

USA . 4,628 parts In-Stock

1+ parts

$9.219

100+ parts

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$9.035

4,628

$9.219

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$9.035

Netroflash

USA . 50 parts In-Stock

1+ parts

$9.219

100+ parts

-

1k+ parts

$8.758

10k+ parts

$8.574

50

$9.219

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$8.758

$8.574

Microchip USA

USA . 5,246 parts In-Stock

1+ parts

$18.024

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5,246

$18.024

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Ampacity Inc.

Singapore . 1,106 parts In-Stock

1+ parts

$56.000

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1,106

$56.000

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West Coast Incorporated

USA . 4,840 parts In-Stock

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4,840

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Argo Parts USA

USA . 552 parts In-Stock

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552

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your clock driver & buffer needs with the ZL40222LDF1 by Microchip Technology. This top-of-the-line product boasts superior quality and reliability, making it a go-to choice for countless applications. With its surface mount capability, differential mux input conditioning, and ultra-thin profile package style, this clock driver offers unmatched precision and performance. Trust in Microchip Technology to deliver cutting-edge solutions that enhance your operations and provide maximum value. Upgrade to the ZL40222LDF1 and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

This product can easily be mounted on PCBs, making it suitable for compact designs and mass production.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer allows for efficient switching between multiple input signals, enhancing signal integrity.

Package Shape: SQUARE

The square package shape provides a uniform footprint, making it easier to design and place on the PCB.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage ensures compatibility with a wide range of applications and power sources.

No. of Terminals: 32

With 32 terminals, this product offers versatile connectivity options for various input and output configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and space-saving benefits.

Propagation Delay (tpd): 2 ns

The low propagation delay of 2ns ensures fast signal processing, ideal for time-critical applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables space-efficient PCB design and integration into compact devices.

Width: 5 mm

The 5mm width provides a compact footprint, ideal for applications where space is limited.

Minimum Supply Voltage (Vsup): 2.375 V

The minimum supply voltage of 2.375V ensures stable operation even under low power conditions.

Length: 5 mm

The 5mm length offers a balanced form factor, making this product suitable for a wide range of PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable performance in harsh industrial environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failures.

Packing Method: TR

The TR packing method provides enhanced protection during shipping and handling, ensuring product integrity upon arrival.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables high-density PCB designs, perfect for applications requiring multiple connections in a limited space.

Maximum Same Edge Skew (tskwd): 150 ns

The maximum same edge skew of 150ns ensures precise signal alignment, reducing potential timing errors and improving overall system performance.

No. of True Outputs: 16

With 16 true outputs, this product offers versatile signal routing and processing capabilities, suitable for complex data handling tasks.

Maximum Supply Voltage (Vsup): 2.625 V

The maximum supply voltage of 2.625V ensures compatibility with a wide range of power sources while providing overhead protection against voltage spikes.

Technical Specifications

Clock Drivers & Buffers ZL40222LDF1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Propagation Delay (tpd):

2 ns

Maximum Same Edge Skew (tskwd):

150 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ZL40222LDF1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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