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NB3N551MNR4G

Onsemi

NB3N551MNR4G by Onsemi

NB3N551MNR4G clock driver by Onsemi features a 6ns propagation delay at 3.3V, with 4 true outputs and a min operating temperature of -40°C. Ideal for industrial applications requiring precise timing control in compact spaces due to its small outline package style and surface-mount capability.

Median Price

$1.206

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,026 parts In-Stock

1+ parts

$1.140

100+ parts

$1.070

1k+ parts

$0.969

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1,026

$1.140

$1.070

$0.969

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Arrow

USA . 10 parts In-Stock

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$2.401

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10

$2.401

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Mouser Electronics

USA . 6,288 parts In-Stock

1+ parts

$2.440

100+ parts

$1.750

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$1.170

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$1.100

6,288

$2.440

$1.750

$1.170

$1.100

Farnell

UK . 6,958 parts In-Stock

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$1.166

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$1.166

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EBV Elektronik

Germany . 4,000 parts In-Stock

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4,000

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DigiKey

USA . 3,000 parts In-Stock

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$1.202

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$1.078

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$1.078

Future Electronics

Canada . 2,000 parts In-Stock

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$1.100

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$1.050

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$1.050

RS (Exports)

UK . 1,400 parts In-Stock

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$1.210

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Element14

Singapore . 734 parts In-Stock

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$1.653

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$1.251

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$1.147

734

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$1.653

$1.251

$1.147

Verical

USA . 10 parts In-Stock

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10

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Distributors (In-Stock)

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Flip Electronics

USA . 1,000 parts In-Stock

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$1.050

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$1.050

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Digiode

USA . 316 parts In-Stock

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$1.083

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$1.083

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Vyrian

USA . 209 parts In-Stock

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$1.100

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$1.100

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Nova Conductors

Japan . 300 parts In-Stock

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$1.366

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300

$1.366

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Cyclops Electronics Ltd

UK . 2,433 parts In-Stock

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Conversion2

USA . 1,268 parts In-Stock

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EPE Components Inc.

USA . 181 parts In-Stock

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Bristol Electronics

USA . 181 parts In-Stock

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Microfarads

USA . 85 parts In-Stock

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85

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Semi Source

USA . 71 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,073 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

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2,073

$0.940

$0.916

$0.912

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Ampacity Inc.

Singapore . 1,904 parts In-Stock

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$0.940

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$0.940

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Corphita

USA . 2,398 parts In-Stock

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$1.026

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$1.026

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Corohmni

South Africa . 137 parts In-Stock

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$1.100

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137

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Aranea Global

USA . 2,000 parts In-Stock

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$1.338

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$1.285

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$1.338

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$1.285

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Argo Parts USA

USA . 3,702 parts In-Stock

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$1.366

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Aztec Data Supply Inc.

USA . 118 parts In-Stock

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$11.940

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$24.775

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$23.536

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$23.536

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$24.775

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$23.536

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Continental Prestige Electronics

USA . 10,088 parts In-Stock

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$1.370

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 7,790 parts In-Stock

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Lixinc

USA . 6,873 parts In-Stock

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SupplyDigital Components

Austria . 5,114 parts In-Stock

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Kulean Microsystems

USA . 4,516 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 912 parts In-Stock

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UHIMA Technologies

Türkiye . 454 parts In-Stock

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TANS Electronics

Latvia . 76 parts In-Stock

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Overview

Discover the NB3N551MNR4G by Onsemi, a top-tier clock driver & buffer that offers precision and reliability. Crafted by a renowned manufacturer, this product ensures superior performance in various applications. With a quick propagation delay and 3-state output characteristics, this device provides seamless operation at an industrial temperature range. Its compact design and surface mount capability make it an ideal choice for space-constrained projects. Trust the NB3N551MNR4G to deliver unmatched efficiency and quality, setting your projects up for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast signal transmission, making this clock driver suitable for time-sensitive applications.

Surface Mount: YES

Easily mountable on circuit boards, simplifying the manufacturing process and saving space.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage, making it compatible with a wide range of systems.

Maximum I (ol): 25 Amp

Capable of driving high current loads, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a factor.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, ensuring reliability in various conditions.

Terminal Finish: MATTE TIN

Provides corrosion resistance and solderability to the terminals, ensuring a reliable connection.

Maximum Same Edge Skew (tskwd): 0.16 ns

Ensures precise synchronization of signals, crucial for maintaining accurate timing in clock applications.

Minimum fmax: 180 MHz

Capable of operating at high frequencies, suitable for demanding clocking requirements in advanced systems.

Technical Specifications

Clock Drivers & Buffers NB3N551MNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

25 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.16 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Minimum fmax:

180 MHz

Trade Compliance

NB3N551MNR4G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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