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NB3N111KMNG

Onsemi

NB3N111KMNG by Onsemi

NB3N111KMNG by Onsemi is a clock driver with 1.1 ns propagation delay at 3.3V, suitable for industrial applications. It features differential input conditioning, 32 terminals in a square package, and operates b/w -40 to 85 °C.

Median Price

$5.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 24,000 parts In-Stock

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-

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24,000

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-

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Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

5,000

-

$4.990

$4.460

$4.200

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$5.780

1k+ parts

-

10k+ parts

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5,000

-

$5.780

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Verical

USA . 4,999 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

4,999

-

$6.237

$5.575

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,831 parts In-Stock

1+ parts

$5.282

100+ parts

-

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1,831

$5.282

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Vyrian

USA . 1,030 parts In-Stock

1+ parts

$5.560

100+ parts

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1,030

$5.560

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Flip Electronics

USA . 31,000 parts In-Stock

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31,000

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,161 parts In-Stock

1+ parts

$4.730

100+ parts

-

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10k+ parts

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8,161

$4.730

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-

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Corphita

USA . 454 parts In-Stock

1+ parts

$5.004

100+ parts

-

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454

$5.004

-

-

-

Corohmni

South Africa . 379 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

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379

$5.560

-

-

-

Component Stockers USA

USA . 129 parts In-Stock

1+ parts

$5.610

100+ parts

$5.280

1k+ parts

$4.770

10k+ parts

-

129

$5.610

$5.280

$4.770

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SupplyDigital Components

Austria . 7,983 parts In-Stock

1+ parts

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7,983

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TANS Electronics

Latvia . 4,414 parts In-Stock

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4,414

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Problanco Electronics

Mexico . 3,443 parts In-Stock

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3,443

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Kulean Microsystems

USA . 1,505 parts In-Stock

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1,505

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UHIMA Technologies

Türkiye . 330 parts In-Stock

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330

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Microchip USA

USA . 202 parts In-Stock

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202

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Continental Prestige Electronics

USA . 148 parts In-Stock

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148

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Perfect Parts

USA . 81 parts In-Stock

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81

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Overview

Unleash the power of precision and efficiency with the NB3N111KMNG clock driver & buffer by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability with this product, perfect for various applications. Experience lightning-fast propagation delay at 1.1 ns and differential input conditioning for seamless performance. With a compact square package shape and a nominal supply voltage of 3.3V, this chip carrier offers unparalleled value and benefits to customers looking for high-performance solutions. Upgrade your systems with the NB3N111KMNG and elevate your projects to new heights of excellence.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1.1 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed clock applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in noise rejection and improves signal integrity, ensuring reliable operation in noisy environments.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a common supply voltage of 3.3V, making it easy to integrate into existing systems without the need for additional power conversion.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure stable performance in industrial applications.

Technical Specifications

Clock Drivers & Buffers NB3N111KMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

1.1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB3N111KMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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