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NB3N2304NZDTR2G

Onsemi

NB3N2304NZDTR2G by Onsemi

NB3N2304NZDTR2G clock driver by Onsemi has a propagation delay of 5ns, operates at 3.3V, and offers 4 true outputs. It is ideal for industrial applications requiring precise timing synchronization in compact designs.

Median Price

$1.614

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,541 parts In-Stock

1+ parts

$1.148

100+ parts

$1.059

1k+ parts

$0.937

10k+ parts

$0.937

1,541

$1.148

$1.059

$0.937

$0.937

Mouser Electronics

USA . 1,735 parts In-Stock

1+ parts

$1.940

100+ parts

$1.450

1k+ parts

$1.040

10k+ parts

$0.959

1,735

$1.940

$1.450

$1.040

$0.959

DigiKey

USA . 2,450 parts In-Stock

1+ parts

$2.180

100+ parts

$1.572

1k+ parts

$1.070

10k+ parts

$0.960

2,450

$2.180

$1.572

$1.070

$0.960

Chip1Stop

Japan . 1,523 parts In-Stock

1+ parts

$2.180

100+ parts

$1.050

1k+ parts

$0.872

10k+ parts

$0.827

1,523

$2.180

$1.050

$0.872

$0.827

Rochester

USA . 24,588 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.030

10k+ parts

$0.918

24,588

-

$1.240

$1.030

$0.918

Verical

USA . 22,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.288

10k+ parts

$1.147

22,076

-

-

$1.288

$1.147

Flip Electronics (Authorized)

USA . 2,724 parts In-Stock

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2,724

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Future Electronics

Canada . 2,500 parts In-Stock

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$0.920

2,500

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$0.920

Master Electronics

USA . 875 parts In-Stock

1+ parts

-

100+ parts

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$3.650

10k+ parts

$0.960

875

-

-

$3.650

$0.960

Distributors (In-Stock)

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Digiode

USA . 1,641 parts In-Stock

1+ parts

$0.762

100+ parts

-

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1,641

$0.762

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Vyrian

USA . 313 parts In-Stock

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$0.802

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313

$0.802

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Chip Stock

USA . 4,070 parts In-Stock

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4,070

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Flip Electronics

USA . 2,724 parts In-Stock

1+ parts

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2,724

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NAC Semi

USA . 2,500 parts In-Stock

1+ parts

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$1.530

2,500

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$1.530

Bristol Electronics

USA . 1,969 parts In-Stock

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1,969

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Atlantic Semiconductor

USA . 1,969 parts In-Stock

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1,969

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Zilex Electronics Inc.

Canada . 1,822 parts In-Stock

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1,822

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IBS Electronics

USA . 875 parts In-Stock

1+ parts

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$5.325

10k+ parts

$1.401

875

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-

$5.325

$1.401

ACDS - Activité Composants Distribution Service

France . 574 parts In-Stock

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574

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Semi Source

USA . 406 parts In-Stock

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406

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Semtec, LLC

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Corphita

USA . 1,434 parts In-Stock

1+ parts

$0.722

100+ parts

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1,434

$0.722

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Corohmni

South Africa . 123 parts In-Stock

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$0.920

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123

$0.920

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Microchip USA

USA . 7,024 parts In-Stock

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$6.798

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$6.798

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Continental Prestige Electronics

USA . 89,112 parts In-Stock

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$1.220

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Perfect Parts

USA . 57,085 parts In-Stock

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TANS Electronics

Latvia . 7,828 parts In-Stock

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Problanco Electronics

Mexico . 7,310 parts In-Stock

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SupplyDigital Components

Austria . 5,825 parts In-Stock

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Authorized Procurement Solutions

USA . 3,878 parts In-Stock

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GreenTree Electronics

Israel . 3,778 parts In-Stock

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Kulean Microsystems

USA . 3,728 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,639 parts In-Stock

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3,639

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,782 parts In-Stock

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1,782

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UHIMA Technologies

Türkiye . 795 parts In-Stock

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795

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Kepictronics

USA . 776 parts In-Stock

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Futuretech Components

Singapore . 708 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 574 parts In-Stock

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574

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Giza Technologies, Inc.

USA . 75 parts In-Stock

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Overview

Upgrade your clock drivers and buffers with the NB3N2304NZDTR2G by Onsemi, a top-tier manufacturer known for quality and reliability. Ideal for a wide range of applications, this product offers unparalleled value with a fast propagation delay of just 5ns, ensuring optimal performance. With a small outline and thin profile package style, this clock driver is easy to integrate into any design. Trust Onsemi to provide cutting-edge technology that exceeds expectations. Elevate your projects with the NB3N2304NZDTR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 5 ns

The low propagation delay ensures fast signal processing, making this clock driver suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with a wide range of electronic devices and systems.

Maximum I (ol): 25 Amp

The high output current capability of 25A enables the clock driver to drive multiple outputs and components without overloading.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this clock driver can withstand high temperatures and harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliability in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability, enhancing the overall performance of the clock driver.

Maximum Same Edge Skew (tskwd): 0.1 ns

The low skew ensures accurate timing synchronization between multiple clock signals, improving overall system performance.

No. of True Outputs: 4

Having 4 true outputs allows for the clock driver to drive multiple components and signals, enhancing the functionality of the system.

Technical Specifications

Clock Drivers & Buffers NB3N2304NZDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Logic IC Type:

Maximum I (ol):

25 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

140 MHz

Trade Compliance

NB3N2304NZDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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