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NB3N121KMNR2G

Onsemi

NB3N121KMNR2G by Onsemi

NB3N121KMNR2G by Onsemi is a clock driver with 0.95 ns propagation delay at 3.3V, suitable for industrial applications. It features 42 true outputs, differential input conditioning, and operates b/w -40 to 85 °C. Ideal for surface mount assembly with a square package shape and quad terminal position.

Median Price

$5.884

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.230

1k+ parts

$4.680

10k+ parts

$4.410

2,000

-

$5.230

$4.680

$4.410

DigiKey

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$6.890

1k+ parts

-

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-

2,000

-

$6.890

-

-

Farnell

UK . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.440

2,000

-

-

-

$4.440

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$6.537

1k+ parts

$5.850

10k+ parts

-

2,000

-

$6.537

$5.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 557 parts In-Stock

1+ parts

$4.440

100+ parts

-

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-

10k+ parts

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557

$4.440

-

-

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Digiode

USA . 85 parts In-Stock

1+ parts

$5.538

100+ parts

-

1k+ parts

-

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-

85

$5.538

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 343 parts In-Stock

1+ parts

$4.440

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$4.440

-

-

-

Corphita

USA . 610 parts In-Stock

1+ parts

$5.247

100+ parts

-

1k+ parts

-

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610

$5.247

-

-

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TANS Electronics

Latvia . 3,945 parts In-Stock

1+ parts

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100+ parts

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3,945

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Microchip USA

USA . 2,863 parts In-Stock

1+ parts

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2,863

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Problanco Electronics

Mexico . 2,198 parts In-Stock

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2,198

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.440

10k+ parts

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2,000

-

-

$4.440

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UHIMA Technologies

Türkiye . 764 parts In-Stock

1+ parts

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764

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Kulean Microsystems

USA . 247 parts In-Stock

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247

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SupplyDigital Components

Austria . 167 parts In-Stock

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167

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Overview

Enhance your electronic designs with the NB3N121KMNR2G by Onsemi. As a leading manufacturer in clock drivers & buffers, Onsemi guarantees top-notch quality and reliability. This versatile chip carrier offers a propagation delay of just 0.95 ns and operates at a wide temperature range, making it ideal for industrial applications. With 42 true outputs and a sleek square package shape, this clock driver ensures efficient performance and easy integration into your projects. Upgrade your systems with the NB3N121KMNR2G and experience seamless functionality and precision timing like never before.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.95 ns

Low propagation delay ensures fast and efficient operation of the clock driver.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in minimizing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with 3.3V power supplies, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during installation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality even in extreme cold conditions.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a maximum supply voltage of 3.6V, providing a margin of safety for voltage fluctuations.

Technical Specifications

Clock Drivers & Buffers NB3N121KMNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.95 ns

Propagation Delay (tpd):

.95 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB3N121KMNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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