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CY23EP09ZXI-1HT

Infineon Technologies

CY23EP09ZXI-1HT by Infineon Technologies

Infineon's CY23EP09ZXI-1HT clock driver has a propagation delay of 2.1ns, 8 true outputs, and operates at a max temperature of 85°C. Ideal for industrial applications requiring precise timing control in compact spaces with a supply voltage range of 2.3V to 2.7V.

Median Price

$15.278

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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2,500

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Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$16.975

1k+ parts

$15.188

10k+ parts

$14.287

2,500

-

$16.975

$15.188

$14.287

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$13.580

1k+ parts

$12.150

10k+ parts

$11.430

2,500

-

$13.580

$12.150

$11.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Vyrian

USA . 2,371 parts In-Stock

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2,371

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Sensible Micro Corp

USA . 419 parts In-Stock

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419

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Digiode

USA . 250 parts In-Stock

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250

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 423 parts In-Stock

1+ parts

$6.608

100+ parts

-

1k+ parts

$6.343

10k+ parts

$6.343

423

$6.608

-

$6.343

$6.343

Ampacity Inc.

Singapore . 2,317 parts In-Stock

1+ parts

$28.000

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2,317

$28.000

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Modulus Dynamics

Lithuania . 516 parts In-Stock

1+ parts

$32.320

100+ parts

$31.027

1k+ parts

$29.734

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516

$32.320

$31.027

$29.734

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Component Stockers USA

USA . 529 parts In-Stock

1+ parts

$213.880

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529

$213.880

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Lixinc

USA . 15,073 parts In-Stock

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Continental Prestige Electronics

USA . 5,305 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,604 parts In-Stock

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4,604

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Argo Parts USA

USA . 4,546 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,069 parts In-Stock

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Kepictronics

USA . 1,375 parts In-Stock

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Corphita

USA . 863 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Discover unmatched precision and reliability with the CY23EP09ZXI-1HT clock driver by Infineon Technologies. Crafted with the highest quality materials and cutting-edge technology, this product guarantees seamless performance in a variety of applications. Unlock the full potential of your electronic devices with the exceptional value and benefits offered by this clock driver. Trust in a brand known for innovation and excellence, choose Infineon Technologies for all your clock driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the clock driver & buffer lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 2.1 ns

Low propagation delay ensures fast signal processing, making this product ideal for high-speed applications where timing is critical.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during installation of the clock driver & buffer.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is commonly used in many electronic systems, providing compatibility and ease of integration with existing setups.

Maximum I (ol): 12 Amp

High output current capacity of 12A ensures that the clock driver & buffer can drive multiple loads without overheating or performance degradation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C ensures reliable performance in various environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this clock driver & buffer can withstand extreme cold environments without malfunctioning.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable operation in harsh industrial settings, making this product a reliable choice for industrial applications.

Technical Specifications

Clock Drivers & Buffers CY23EP09ZXI-1HT attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Family:

23EP

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

2.1 ns

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.11 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

10 MHz

Trade Compliance

CY23EP09ZXI-1HT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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