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CDCLVD2102RGTT

Texas Instruments

CDCLVD2102RGTT by Texas Instruments

CDCLVD2102RGTT by Texas Instruments is a clock driver with 2.5 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 2.5V and has a max operating temperature of 85°C. This chip carrier package features differential input conditioning and surface mount capability.

Median Price

$8.294

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,993 parts In-Stock

1+ parts

$6.120

100+ parts

$4.989

1k+ parts

$3.326

10k+ parts

-

1,993

$6.120

$4.989

$3.326

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Chip1Stop

Japan . 141 parts In-Stock

1+ parts

$7.885

100+ parts

$4.306

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-

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141

$7.885

$4.306

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Arrow

USA . 188 parts In-Stock

1+ parts

$8.702

100+ parts

$5.129

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-

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188

$8.702

$5.129

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DigiKey

USA . 1,660 parts In-Stock

1+ parts

$8.790

100+ parts

$5.800

1k+ parts

$5.310

10k+ parts

$5.174

1,660

$8.790

$5.800

$5.310

$5.174

Mouser Electronics

USA . 592 parts In-Stock

1+ parts

$8.790

100+ parts

$5.800

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$5.170

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592

$8.790

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$5.170

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Verical

USA . 188 parts In-Stock

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-

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$5.129

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188

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$5.129

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$5.465

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-

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29

$5.465

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Digiode

USA . 3,121 parts In-Stock

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$5.814

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3,121

$5.814

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Vyrian

USA . 5,480 parts In-Stock

1+ parts

-

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5,480

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Chip Stock

USA . 726 parts In-Stock

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726

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Semi Source

USA . 7 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 391 parts In-Stock

1+ parts

$3.172

100+ parts

-

1k+ parts

$3.045

10k+ parts

$3.045

391

$3.172

-

$3.045

$3.045

Ampacity Inc.

Singapore . 119 parts In-Stock

1+ parts

$3.710

100+ parts

-

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119

$3.710

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Continental Prestige Electronics

USA . 3,404 parts In-Stock

1+ parts

$5.465

100+ parts

-

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$5.355

3,404

$5.465

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$5.355

Netroflash

USA . 2,000 parts In-Stock

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$5.465

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2,000

$5.465

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Corphita

USA . 257 parts In-Stock

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$5.508

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$5.508

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Corohmni

South Africa . 58 parts In-Stock

1+ parts

$8.754

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58

$8.754

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Parana Technologies

USA . 1,764 parts In-Stock

1+ parts

$22.777

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$23.441

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1,764

$22.777

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$23.441

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DigiPath Technology Company

USA . 428 parts In-Stock

1+ parts

$25.080

100+ parts

$23.074

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428

$25.080

$23.074

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ChromeModa Solutions

Germany . 2,286 parts In-Stock

1+ parts

$25.592

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$20.985

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2,286

$25.592

$20.985

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IDEA Electronic Components Group

UK . 391 parts In-Stock

1+ parts

$25.592

100+ parts

$24.312

1k+ parts

$23.033

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391

$25.592

$24.312

$23.033

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$31.780

100+ parts

$28.920

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$26.060

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200

$31.780

$28.920

$26.060

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iodParts Technologies Inc.

India . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,010 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,673 parts In-Stock

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Argo Parts USA

USA . 3,697 parts In-Stock

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Lixinc

USA . 2,167 parts In-Stock

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2,167

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Overview

Enhance your electronics projects with the CDCLVD2102RGTT by Texas Instruments, a top-tier clock driver and buffer that guarantees precision and reliability. Crafted by industry leader Texas Instruments, this chip carrier package boasts a minimal propagation delay of 2.5 ns, making it ideal for high-speed applications. With a wide range of functions and differential input conditioning, it excels in various settings. Elevate your designs with this industrial-grade solution that offers unmatched performance and efficiency, setting you apart from the competition. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - provides durability and moisture resistance, making the product reliable in various conditions.

Propagation Delay at Nominal Supply

2.5 ns - ensures fast signal propagation, making the product suitable for high-speed applications.

Surface Mount

YES - makes the product easy to integrate onto circuit boards, saving space and facilitating automated assembly.

Input Conditioning

DIFFERENTIAL - allows for noise immunity and improved signal integrity, ensuring accurate data transmission.

Nominal Supply Voltage / Vsup (V)

2.5 - provides a stable power source for the product to operate reliably within specifications.

Maximum Operating Temperature

85°C - ensures the product can perform in a wide range of environmental conditions without overheating.

Minimum Operating Temperature

-40°C - allows the product to operate in cold temperatures, suitable for various industrial settings.

Maximum Time At Peak Reflow Temperature (s)

30 - provides a sufficient window for reflow soldering, making the product easy to assemble in manufacturing processes.

Minimum fmax

800 MHz - supports high-frequency operations, making the product ideal for demanding clock driver and buffer applications.

Technical Specifications

Clock Drivers & Buffers CDCLVD2102RGTT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

106 mA

Propagation Delay At Nominal Supply:

2.5 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCLVD2102RGTT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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