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LMK03318RHSR

Texas Instruments

LMK03318RHSR by Texas Instruments

LMK03318RHSR clock driver by Texas Instruments operates at 3.3V with 48 terminals in a square package style. It features differential mux input conditioning, 16 true outputs, and a min operating temperature of -40°C. Ideal for industrial applications requiring precise timing control and signal synchronization.

Median Price

$10.126

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 63,521 parts In-Stock

1+ parts

$10.126

100+ parts

$8.845

1k+ parts

$6.100

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63,521

$10.126

$8.845

$6.100

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Distributors (In-Stock)

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Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$6.776

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64

$6.776

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Digiode

USA . 820 parts In-Stock

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$9.620

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820

$9.620

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Chip Stock

USA . 5,690 parts In-Stock

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5,690

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Vyrian

USA . 2,470 parts In-Stock

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2,470

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Inventory MP

USA . 174 parts In-Stock

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174

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Bristol Electronics

USA . 174 parts In-Stock

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174

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Semtec, LLC

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,450 parts In-Stock

1+ parts

$6.776

100+ parts

-

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10k+ parts

$6.640

6,450

$6.776

-

-

$6.640

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.776

100+ parts

-

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$6.437

10k+ parts

$6.302

50

$6.776

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$6.437

$6.302

Andel Nordic

Denmark . 2,372 parts In-Stock

1+ parts

$8.184

100+ parts

-

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$7.856

10k+ parts

$7.856

2,372

$8.184

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$7.856

$7.856

Ampacity Inc.

Singapore . 63,276 parts In-Stock

1+ parts

$8.610

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63,276

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Corphita

USA . 3,141 parts In-Stock

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$9.113

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AZTECH Wire

Italy . 446 parts In-Stock

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$20.690

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446

$20.690

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Corohmni

South Africa . 20 parts In-Stock

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$25.253

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20

$25.253

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Parana Technologies

USA . 2 parts In-Stock

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$30.258

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$68.920

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$30.258

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$68.920

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DigiPath Technology Company

USA . 1,748 parts In-Stock

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$33.318

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$30.653

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1,748

$33.318

$30.653

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ChromeModa Solutions

Germany . 3,718 parts In-Stock

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$33.998

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$27.878

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3,718

$33.998

$27.878

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

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$33.998

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$32.298

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$30.598

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1,632

$33.998

$32.298

$30.598

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A-Z Elektronik GmbH

Germany . 6,528 parts In-Stock

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S.R.D Solutions

India . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,352 parts In-Stock

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Lixinc

USA . 4,151 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Perfect Parts

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Argo Parts USA

USA . 437 parts In-Stock

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437

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Overview

Enhance your electronic designs with the LMK03318RHSR clock driver and buffer from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. This versatile component is ideal for a wide range of applications, offering precise synchronization and signal distribution. With its compact design and advanced features, the LMK03318RHSR provides unparalleled value and performance to help you achieve optimal results in your projects. Trust Texas Instruments to elevate your designs with cutting-edge technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for manufacturers.

Input Conditioning: DIFFERENTIAL MUX

Enables efficient handling of multiple inputs, allowing for more versatile applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages, ensuring seamless integration into existing systems.

No. of Terminals: 48

Provides ample connectivity options for various external devices, making it flexible for different setups.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, making it suitable for a wide range of environments.

Terminal Finish: Matte Tin (Sn)

Provides reliable electrical connections and corrosion resistance, ensuring consistent performance over time.

Terminal Position: QUAD

Organized terminal layout for easy connection and troubleshooting, reducing the risk of errors during installation.

Width: 7 mm

Compact size allows for efficient use of space on a circuit board.

Minimum Supply Voltage (Vsup): 3.135 V

Tolerance for lower supply voltage ensures stable operation even with slight fluctuations in power supply.

Minimum fmax: 200 MHz

High maximum frequency capability allows for fast signal processing, suitable for applications that require quick response times.

Technical Specifications

Clock Drivers & Buffers LMK03318RHSR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

LMK

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Same Edge Skew (tskwd):

1.5 ns

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Minimum fmax:

200 MHz

Trade Compliance

LMK03318RHSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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