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LMK00304SQX/NOPB

Texas Instruments

LMK00304SQX/NOPB by Texas Instruments

LMK00304SQX/NOPB by Texas Instruments is a clock driver with a propagation delay of 2.7 ns, suitable for surface mount applications. It has differential mux input conditioning and operates at a nominal voltage of 3.3V.

Median Price

$5.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Texas Instruments

USA . 5,165 parts In-Stock

1+ parts

$5.360

100+ parts

$4.370

1k+ parts

$2.913

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5,165

$5.360

$4.370

$2.913

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$2.913

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-

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50

$2.913

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Digiode

USA . 3,240 parts In-Stock

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$5.092

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3,240

$5.092

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Maritex

Poland . 405 parts In-Stock

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$5.526

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$3.469

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$2.817

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405

$5.526

$3.469

$2.817

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Chip Stock

USA . 17,070 parts In-Stock

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Vyrian

USA . 6,185 parts In-Stock

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Sensible Micro Corp

USA . 3,524 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 546 parts In-Stock

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$2.913

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546

$2.913

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Continental Prestige Electronics

USA . 2,402 parts In-Stock

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$2.913

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$2.855

2,402

$2.913

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$2.855

Argo Parts USA

USA . 1,245 parts In-Stock

1+ parts

$2.913

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$2.913

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Netroflash

USA . 50 parts In-Stock

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$2.913

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50

$2.913

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.971

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$2.971

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$2.971

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1,000

$2.971

$2.971

$2.971

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Ampacity Inc.

Singapore . 5,121 parts In-Stock

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$4.560

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$4.560

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Semicontronic

India . 4,851 parts In-Stock

1+ parts

$4.560

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$4.446

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$4.423

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4,851

$4.560

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$4.423

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Corphita

USA . 921 parts In-Stock

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$4.824

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921

$4.824

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Andel Nordic

Denmark . 866 parts In-Stock

1+ parts

$6.972

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$6.693

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$6.693

866

$6.972

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$6.693

$6.693

AZTECH Wire

Italy . 666 parts In-Stock

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$15.090

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666

$15.090

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Parana Technologies

USA . 41 parts In-Stock

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$20.347

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$20.367

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$20.347

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DigiPath Technology Company

USA . 744 parts In-Stock

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$22.405

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$22.405

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ChromeModa Solutions

Germany . 3,891 parts In-Stock

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$22.862

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$18.747

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$22.862

$18.747

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

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$22.862

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$21.719

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$20.576

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$22.862

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Lixinc

USA . 14,847 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

Germany . 3,723 parts In-Stock

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Component Stockers USA

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Overview

Discover the LMK00304SQX/NOPB by Texas Instruments, a high-quality clock driver and buffer that offers unrivaled performance for a wide range of applications. Manufactured by Texas Instruments, a trusted industry leader known for their innovative solutions, this product guarantees reliability and precision. Designed with advanced technology, it provides fast propagation delay and supports surface mount installation. With its differential mux input conditioning and 3-state output characteristics, this clock driver ensures seamless integration into any system. Whether you're working on industrial automation or telecommunications projects, the LMK00304SQX/NOPB is the perfect choice for delivering exceptional results. Experience the value, benefits, and advantages this product brings to your designs today!

Feature Benefit Bullets

Propagation Delay: 2.7 ns

Fast propagation delay ensures efficient clock signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Input Conditioning: DIFFERENTIAL MUX

Provides reliable input signal conditioning and multiplexing capabilities, enhancing overall signal quality and versatility.

No. of Functions: 1

This clock driver and buffer offers a single function, simplifying design and reducing complexity.

Package Shape: SQUARE

The square package shape enables efficient use of board space and facilitates easy mounting.

Nominal Supply Voltage: 3.3V

Designed to operate at a stable and commonly used supply voltage, ensuring compatibility with various systems.

Load Capacitance: 5 pF

Optimized for driving capacitive loads up to 5 pF, making it suitable for driving a range of devices and circuits.

Power Supplies: 2.5/3.3,3.3V

Supports multiple power supply options, providing flexibility and compatibility with different systems.

No. of Terminals: 32

Equipped with 32 terminals for simplified connectivity and versatile integration into circuit layouts.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers effective heat dissipation, space efficiency, and a low profile for compact designs with improved thermal management.

Maximum Operating Temperature: 85°C

Designed to withstand higher operating temperatures, making it suitable for industrial environments.

Output Characteristics: 3-STATE

Provides 3-STATE output control, allowing for flexible bus terminations and reduced power consumption.

Minimum Operating Temperature: -40°C

Capable of functioning reliably in low-temperature environments, ensuring performance across a wide range of conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures superior solderability and long-term reliability.

Terminal Position: QUAD

Quad terminal arrangement facilitates simple and secure connections, enhancing ease of use during installation.

Maximum Seated Height: 0.8 mm

With a low seated height, this product is suitable for compact designs where space is limited.

Width: 5 mm

Compact width allows for efficient utilization of board space in tight layouts.

Minimum Supply Voltage: 3.15V

This product can operate reliably even with slightly lower supply voltages, providing flexibility in power requirements.

Maximum Time At Peak Reflow Temperature: 30s

Can withstand the maximum specified reflow temperature for up to 30 seconds during the soldering process.

Peak Reflow Temperature: 260°C

Designed to endure high-temperature solder reflow processes while maintaining performance and reliability.

Length: 5 mm

Compact length allows for effective space utilization and compatibility with various board layouts.

Temperature Grade: INDUSTRIAL

Designed and rated to function reliably in industrial temperature range, ensuring suitability for demanding environments.

Terminal Form: NO LEAD

Incorporates a lead-free terminal form, complying with environmental regulations and reducing potential harm.

Packing Method: TR

Utilizes tape and reel packing method for convenient handling during manufacturing and assembly processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and improves overall electrical performance.

Maximum Same Edge Skew: 0.05 ns

Minimal skew between outputs ensures synchronized clock signals, critical for maintaining system integrity and performance.

No. of True Outputs: 4

Offers four true outputs, providing ample options for driving multiple circuits and devices simultaneously.

Minimum fmax: 3100 MHz

Minimal frequency limitation enables high-speed operation, making it suitable for demanding applications.

Moisture Sensitivity Level: 3

Certified to have a moderate moisture sensitivity level, ensuring reliable performance during storage and reflow processes.

Maximum Supply Voltage: 3.45V

Can handle higher supply voltages, providing a safe operating range and minimizing risks associated with voltage spikes.

Maximum Power Supply Current: 13.5 mA

Designed with low power consumption, making it energy-efficient and reducing overall system power requirements.

Technical Specifications

Clock Drivers & Buffers LMK00304SQX/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

00304

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3.3

Maximum Power Supply Current (ICC):

13.5 mA

Propagation Delay At Nominal Supply:

2.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

3100 MHz

Trade Compliance

LMK00304SQX/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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