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LMK01000ISQE/NOPB

Texas Instruments

LMK01000ISQE/NOPB by Texas Instruments

LMK01000ISQE/NOPB clock driver by Texas Instruments operates at 3.3V, with 48 terminals and a max output current of 0.5A. It features differential input conditioning, 8 true outputs up to 1600MHz, and industrial temperature grade suitability. Ideal for applications requiring precise clock signal distribution in compact spaces.

Median Price

$15.113

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 123 parts In-Stock

1+ parts

$11.762

100+ parts

$11.556

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-

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123

$11.762

$11.556

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Verical

USA . 123 parts In-Stock

1+ parts

$12.145

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$11.556

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123

$12.145

$11.556

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Texas Instruments

USA . 12,466 parts In-Stock

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$15.113

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$13.201

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$9.104

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12,466

$15.113

$13.201

$9.104

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DigiKey

USA . 622 parts In-Stock

1+ parts

$22.860

100+ parts

$15.943

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$14.992

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622

$22.860

$15.943

$14.992

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Arrow

USA . 250 parts In-Stock

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$15.116

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$15.116

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Distributors (In-Stock)

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Digiode

USA . 3,279 parts In-Stock

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$11.174

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3,279

$11.174

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Nova Conductors

Japan . 450 parts In-Stock

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$14.010

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450

$14.010

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Vyrian

USA . 2,147 parts In-Stock

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2,147

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TME

Poland . 250 parts In-Stock

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$16.920

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250

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$16.920

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Chip Stock

USA . 178 parts In-Stock

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178

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Anansix

USA . 90 parts In-Stock

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90

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Netsource Technology, Inc.

USA . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,393 parts In-Stock

1+ parts

$9.820

100+ parts

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2,393

$9.820

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Semicontronic

India . 2,244 parts In-Stock

1+ parts

$9.820

100+ parts

$9.574

1k+ parts

$9.525

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2,244

$9.820

$9.574

$9.525

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Corphita

USA . 3,810 parts In-Stock

1+ parts

$10.586

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3,810

$10.586

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$12.298

100+ parts

$11.191

1k+ parts

$10.084

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270

$12.298

$11.191

$10.084

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Continental Prestige Electronics

USA . 4,136 parts In-Stock

1+ parts

$14.010

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$13.730

4,136

$14.010

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$13.730

Netroflash

USA . 100 parts In-Stock

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$14.010

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100

$14.010

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Parana Technologies

USA . 990 parts In-Stock

1+ parts

$25.669

100+ parts

$2,383.791

1k+ parts

$23.102

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990

$25.669

$2,383.791

$23.102

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DigiPath Technology Company

USA . 1,743 parts In-Stock

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$28.265

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1,743

$28.265

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ChromeModa Solutions

Germany . 4,022 parts In-Stock

1+ parts

$28.842

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$23.650

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4,022

$28.842

$23.650

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IDEA Electronic Components Group

UK . 366 parts In-Stock

1+ parts

$28.842

100+ parts

$27.400

1k+ parts

$25.958

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366

$28.842

$27.400

$25.958

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Corohmni

South Africa . 713 parts In-Stock

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$31.930

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Argo Parts USA

USA . 4,873 parts In-Stock

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Andel Nordic

Denmark . 3,444 parts In-Stock

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Perfect Parts

USA . 1,605 parts In-Stock

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1,605

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Overview

Enhance the performance of your electronic devices with the LMK01000ISQE/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Clock Drivers & Buffers that guarantee precision and reliability. Ideal for a wide range of applications, this product offers exceptional value with its differential input conditioning, 3-STATE output characteristics, and industrial-grade temperature range. Trust in Texas Instruments to provide cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the superior quality of the LMK01000ISQE/NOPB.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB.

Input Conditioning: DIFFERENTIAL

Provides accurate signal processing and noise rejection for reliable performance.

Package Shape: SQUARE

Offers uniformity in design and facilitates easy handling during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable for a wide range of applications that require a stable power source.

Power Supplies (V): 3.3

Consistent power delivery ensures consistent functionality in various environments.

No. of Terminals: 48

Sufficient number of terminals for connectivity options and signal routing.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal management and allows for compact designs.

Maximum I (ol): 0.5 Amp

Capable of driving high loads without compromising performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where temperature fluctuations are common.

Output Characteristics: 3-STATE

Provides flexibility in output control for different operational modes.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-term reliability in various environments.

Terminal Position: QUAD

Facilitates easy connection to other components on the PCB.

Maximum Seated Height: 0.8 mm

Low profile design for space-constrained applications.

Width: 7 mm

Compact size for easy integration into different systems.

Minimum Supply Voltage (Vsup): 3.15 V

Provides a safe operating range for the device to function properly.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during the assembly process.

Peak Reflow Temperature °C: 260

Supports lead-free soldering processes for environmentally friendly manufacturing.

Length: 7 mm

Balanced dimensions for easy PCB layout and installation.

Temperature Grade: INDUSTRIAL

Suitable for rugged environments and demanding industrial applications.

Terminal Form: NO LEAD

Lead-free construction for RoHS compliance and environmental sustainability.

Packing Method: TR

Trays packaging for secure transportation and storage.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density interconnects.

Maximum Same Edge Skew (tskwd): 0.03 ns

Delivers precise timing signals for synchronous operations.

No. of True Outputs: 8

Provides multiple output signals for diverse applications.

Minimum fmax: 1600 MHz

High frequency capabilities for fast data processing and signal transmission.

Moisture Sensitivity Level (MSL): 3

Suitable for environments with moderate moisture exposure.

Maximum Supply Voltage (Vsup): 3.45 V

Safeguarded against voltage spikes for improved reliability.

Technical Specifications

Clock Drivers & Buffers LMK01000ISQE/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

01000

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

1600 MHz

Trade Compliance

LMK01000ISQE/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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