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CY7B994V-5BBCT

Infineon Technologies

CY7B994V-5BBCT by Infineon Technologies

CY7B994V-5BBCT clock driver by Infineon Technologies features a 3.3V supply voltage, 100 terminals, and 0.5ns propagation delay. It is used in applications requiring differential mux input conditioning and 16 true outputs with a max frequency of 200MHz. The package style is grid array with low profile design for compact installations.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Flip Electronics

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Vyrian

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Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

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Bristol Electronics

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Digiode

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Nova Conductors

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EMSNET

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Ampacity Inc.

Singapore . 999 parts In-Stock

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Andel Nordic

Denmark . 5,796 parts In-Stock

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AZTECH Wire

Italy . 535 parts In-Stock

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Modulus Dynamics

Lithuania . 75 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Alle Elektronik GmbH

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Bastille Electronics

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Corphita

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Overview

Upgrade your clock driving experience with the CY7B994V-5BBCT by Infineon Technologies. Designed with precision and reliability in mind, this clock driver offers unparalleled performance for a wide range of applications. With its advanced features and top-notch quality, Infineon Technologies sets the standard for excellence in the industry. Say goodbye to worries about timing issues and hello to seamless synchronization with the CY7B994V-5BBCT. Experience the value, benefits, and advantages that only this product can offer. Elevate your projects to the next level with this cutting-edge clock driver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring longevity and reliable performance.

Surface Mount: YES

Allows for easy integration onto printed circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

Helps in minimizing noise and improving signal integrity, leading to accurate clock synchronization.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common power supply standards, making it suitable for various applications.

No. of Terminals: 100

Provides flexibility in connecting to other components and peripherals in a system.

Propagation Delay (tpd): 0.5 ns

Offers fast signal processing and timing alignment, crucial for efficient clock distribution.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Allows for high impedance output when disabled, reducing power consumption and preventing signal interference.

Minimum Operating Temperature: 0 °C

Ensures reliable operation in various environmental conditions, including low-temperature environments.

Maximum Power Supply Current (ICC): 250 mA

Supports high current requirements, enabling the clock driver to drive multiple components without issues.

Technical Specifications

Clock Drivers & Buffers CY7B994V-5BBCT attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

7B

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PBGA-B100

Length:

11 mm

Logic IC Type:

Maximum I (ol):

30 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

100

No. of True Outputs:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

250 mA

Propagation Delay (tpd):

.5 ns

Maximum Same Edge Skew (tskwd):

.8 ns

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

11 mm

Minimum fmax:

200 MHz

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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