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CY7B992-5JXI

Infineon Technologies

CY7B992-5JXI by Infineon Technologies

CY7B992-5JXI by Infineon Technologies is a clock driver & buffer with 4 functions. It has a propagation delay of 0.7 ns and operates at a nominal voltage of 5V. This chip carrier package is commonly used in industrial applications requiring high-speed clocking.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 821 parts In-Stock

1+ parts

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821

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Digiode

USA . 492 parts In-Stock

1+ parts

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492

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,992 parts In-Stock

1+ parts

$2.688

100+ parts

-

1k+ parts

$2.580

10k+ parts

$2.580

3,992

$2.688

-

$2.580

$2.580

Semicontronic

India . 1,335 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

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-

1,335

$14.000

$13.650

$13.580

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Ampacity Inc.

Singapore . 188 parts In-Stock

1+ parts

$14.000

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188

$14.000

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Modulus Dynamics

Lithuania . 1,378 parts In-Stock

1+ parts

$17.113

100+ parts

$16.428

1k+ parts

$15.744

10k+ parts

-

1,378

$17.113

$16.428

$15.744

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AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$19.575

100+ parts

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821

$19.575

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$39.578

100+ parts

$36.016

1k+ parts

$32.454

10k+ parts

-

2,500

$39.578

$36.016

$32.454

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Continental Prestige Electronics

USA . 5,357 parts In-Stock

1+ parts

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5,357

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Argo Parts USA

USA . 2,951 parts In-Stock

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2,951

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Corphita

USA . 718 parts In-Stock

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718

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Perfect Parts

USA . 335 parts In-Stock

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335

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Bastille Electronics

Australia . 15 parts In-Stock

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15

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Overview

Discover the CY7B992-5JXI by Infineon Technologies, a top-of-the-line clock driver and buffer that offers unparalleled quality, reliability, and performance. As a leading manufacturer in the industry, Infineon Technologies has a proven track record of delivering cutting-edge products that meet the highest standards. The CY7B992-5JXI is designed for a wide range of applications and boasts numerous benefits and advantages. With its fast propagation delay, it ensures precise timing and synchronization, while its compact chip carrier package allows for easy integration. Whether you're in the automotive, telecommunications, or consumer electronics industry, this versatile product will exceed your expectations. Experience the value of exceptional performance with the CY7B992-5JXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components of the clock driver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 0.7 ns

With a low propagation delay of only 0.7 ns at nominal supply voltage, this clock driver offers fast signal processing and efficient performance.

Surface Mount: YES

Being surface mountable, this clock driver is easy to install, saves space on PCBs, and allows for efficient heat dissipation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V, this clock driver is compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this clock driver can function reliably in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers CY7B992-5JXI attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

7B

Input Conditioning:

STANDARD

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Logic IC Type:

Maximum I (ol):

46 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

.7 ns

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1.5 ns

Maximum Seated Height:

3.556 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.43 mm

Minimum fmax:

80 MHz

Trade Compliance

CY7B992-5JXI Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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