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CY7B994V-2BBIT

Infineon Technologies

CY7B994V-2BBIT by Infineon Technologies

CY7B994V-2BBIT clock driver by Infineon features 100 terminals, 3.3V supply voltage, and 0.25ns propagation delay. Ideal for applications requiring differential mux input conditioning and a max operating temperature of 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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8,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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8,000

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Vyrian

USA . 7,934 parts In-Stock

1+ parts

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7,934

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Digiode

USA . 435 parts In-Stock

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435

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,793 parts In-Stock

1+ parts

$9.882

100+ parts

$9.487

1k+ parts

$9.091

10k+ parts

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3,793

$9.882

$9.487

$9.091

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Corohmni

South Africa . 168 parts In-Stock

1+ parts

$18.501

100+ parts

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168

$18.501

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Advanced Electronics

New Zealand . 51 parts In-Stock

1+ parts

$26.200

100+ parts

$23.842

1k+ parts

$21.484

10k+ parts

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51

$26.200

$23.842

$21.484

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Ampacity Inc.

Singapore . 7,936 parts In-Stock

1+ parts

$28.000

100+ parts

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7,936

$28.000

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QUARKTWIN TECHNOLOGY LTD

USA . 11,970 parts In-Stock

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11,970

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Microchip USA

USA . 5,873 parts In-Stock

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5,873

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Continental Prestige Electronics

USA . 5,137 parts In-Stock

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5,137

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Argo Parts USA

USA . 4,666 parts In-Stock

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4,666

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 287 parts In-Stock

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287

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Bastille Electronics

Australia . 80 parts In-Stock

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80

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Overview

Discover the unmatched reliability and precision of the CY7B994V-2BBIT clock driver by Infineon Technologies. With a focus on quality and innovation, Infineon Technologies delivers cutting-edge solutions for clock drivers & buffers that exceed industry standards. Ideal for a wide range of applications, this product offers customers unparalleled value and performance. Trust in Infineon Technologies to provide you with the tools you need to drive success and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and cost-effective, making it a good choice for long-lasting use.

Surface Mount:

YES - Surface mounting saves space and simplifies the PCB layout, making installation easier.

Input Conditioning:

DIFFERENTIAL MUX - Provides versatile input options for different signal requirements, increasing flexibility.

Package Shape:

SQUARE - The square shape allows for easier integration into the PCB layout, optimizing space usage.

Nominal Supply Voltage / Vsup (V):

3.3 - Compatible with common voltage requirements, ensuring ease of integration into existing systems.

No. of Terminals:

100 - Sufficient terminals for connecting multiple components, allowing for versatile configurations.

Package Style (Meter):

GRID ARRAY, LOW PROFILE - The low profile design saves space and provides a sleek appearance.

Maximum I (ol):

30 Amp - High output current capability for driving demanding loads, suitable for high-performance applications.

Propagation Delay (tpd):

0.25 ns - Fast signal propagation ensures minimal delay in signal transmission, enhancing system efficiency.

Maximum Operating Temperature:

85 °C - Wide operating temperature range for reliable performance in various environmental conditions.

Output Characteristics:

3-STATE WITH SERIES RESISTOR - The 3-state output with series resistor allows for tristate control, increasing design flexibility.

Minimum Operating Temperature:

40 °C - Able to withstand low temperatures, making it suitable for use in cold environments.

Terminal Position:

BOTTOM - Bottom terminal positioning simplifies PCB layout and reduces interference with other components.

Maximum Seated Height:

1.4 mm - Low profile and compact design for easy integration into space-constrained applications.

Width:

11 mm - Compact width for efficient use of PCB real estate, suitable for compact designs.

Minimum Supply Voltage (Vsup):

2.97 V - Low minimum supply voltage requirement for compatibility with various power sources.

Length:

11 mm - Compact length for space-saving installation in tight spaces.

Terminal Form:

BALL - Ball terminals provide reliable connections and simplify soldering during installation.

Packing Method:

TR - Tray packaging method ensures secure transportation and storage of the product.

Terminal Pitch:

1 mm - Fine terminal pitch for high-density mounting, suitable for space-constrained applications.

Maximum Same Edge Skew (tskwd):

0.5 ns - Low skew for consistent signal timing, ensuring reliable data transmission.

No. of True Outputs:

6 - Multiple true outputs for versatile signal routing options, enhancing system flexibility.

Minimum fmax:

200 MHz - High maximum operating frequency for fast signal processing, suitable for high-speed applications.

Maximum Supply Voltage (Vsup):

3.63 V - Maximum supply voltage handling capability for compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC):

250 mA - High power supply current for driving multiple components, suitable for power-hungry applications.

Technical Specifications

Clock Drivers & Buffers CY7B994V-2BBIT attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

7B

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PBGA-B100

Length:

11 mm

Logic IC Type:

Maximum I (ol):

30 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

100

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

250 mA

Propagation Delay (tpd):

.25 ns

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

11 mm

Minimum fmax:

200 MHz

Trade Compliance

CY7B994V-2BBIT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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