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NB3N551DG

Onsemi

NB3N551DG by Onsemi

NB3N551DG clock driver by Onsemi has a 6ns propagation delay at 3.3V, with 4 true outputs and 180MHz fmax. Ideal for industrial applications, it features a small outline package with surface mount capability and operates b/w -40 to 85°C.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 146 parts In-Stock

1+ parts

$1.140

100+ parts

$1.100

1k+ parts

$1.010

10k+ parts

$0.920

146

$1.140

$1.100

$1.010

$0.920

Arrow

USA . 202 parts In-Stock

1+ parts

$1.658

100+ parts

$1.261

1k+ parts

$0.977

10k+ parts

$0.882

202

$1.658

$1.261

$0.977

$0.882

Farnell

UK . 273 parts In-Stock

1+ parts

$1.940

100+ parts

$1.170

1k+ parts

$0.782

10k+ parts

$0.777

273

$1.940

$1.170

$0.782

$0.777

Mouser Electronics

USA . 1,635 parts In-Stock

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$2.070

100+ parts

$1.450

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$1.040

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$0.940

1,635

$2.070

$1.450

$1.040

$0.940

DigiKey

USA . 2,237 parts In-Stock

1+ parts

$2.140

100+ parts

$1.542

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$1.267

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$0.941

2,237

$2.140

$1.542

$1.267

$0.941

Chip1Stop

Japan . 18 parts In-Stock

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$2.860

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18

$2.860

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Verical

USA . 202 parts In-Stock

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$1.261

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$0.977

10k+ parts

$0.882

202

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$1.261

$0.977

$0.882

Distributors (In-Stock)

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Digiode

USA . 1,129 parts In-Stock

1+ parts

$1.083

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-

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1,129

$1.083

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Nova Conductors

Japan . 100 parts In-Stock

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$1.100

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100

$1.100

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Vyrian

USA . 2,466 parts In-Stock

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$1.140

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$1.140

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Chip Stock

USA . 4,000 parts In-Stock

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Sensible Micro Corp

USA . 455 parts In-Stock

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455

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Cyclops Electronics Ltd

UK . 154 parts In-Stock

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154

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Prism Electronics

USA . 109 parts In-Stock

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109

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Bristol Electronics

USA . 60 parts In-Stock

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60

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J2 Sourcing AB

Sweden . 22 parts In-Stock

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Semi Source

USA . 14 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 565 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

10k+ parts

-

565

$0.970

$0.946

$0.941

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Ampacity Inc.

Singapore . 432 parts In-Stock

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$0.970

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432

$0.970

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Corphita

USA . 289 parts In-Stock

1+ parts

$1.026

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289

$1.026

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Argo Parts USA

USA . 2,920 parts In-Stock

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$1.100

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2,920

$1.100

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Continental Prestige Electronics

USA . 1,499 parts In-Stock

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$1.100

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$1.078

1,499

$1.100

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$1.078

Corohmni

South Africa . 348 parts In-Stock

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$1.140

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348

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Aztec Data Supply Inc.

USA . 3,356 parts In-Stock

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$15.720

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Lixinc

USA . 13,797 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,164 parts In-Stock

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Microchip USA

USA . 10,982 parts In-Stock

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Problanco Electronics

Mexico . 7,551 parts In-Stock

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Kulean Microsystems

USA . 6,923 parts In-Stock

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SupplyDigital Components

Austria . 4,977 parts In-Stock

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TANS Electronics

Latvia . 3,899 parts In-Stock

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Metaverse IC Inc.

Canada . 1,357 parts In-Stock

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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836

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GreenTree Electronics

Israel . 294 parts In-Stock

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Kepictronics

USA . 135 parts In-Stock

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Bastille Electronics

Australia . 19 parts In-Stock

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Overview

Enhance your electronic designs with the NB3N551DG clock driver and buffer by Onsemi. Manufactured with precision and quality in mind, this product is designed to optimize performance and reliability. Ideal for a wide range of applications, this clock driver offers fast propagation delay and 3-STATE output characteristics. With a small outline package style and industrial temperature grade, this device provides exceptional value and benefits to customers seeking efficient and dependable clock drivers for their projects. Trust Onsemi for innovative solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and reliability for the package, ensuring long-term performance.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures efficient and fast signal transmission, making this product suitable for time-critical applications.

Surface Mount: YES

Surface mount capability enables easy installation and integration into compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage, ensuring compatibility with various systems and components.

Output Characteristics: 3-STATE

3-STATE output allows the device to have high impedance state, providing flexibility in system design and connectivity.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows reliable performance in diverse environmental conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly processes, ensuring proper soldering.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy PCB layout and soldering, streamlining manufacturing processes.

No. of True Outputs: 4

Multiple true outputs provide flexibility in signal routing and distribution within the system.

Technical Specifications

Clock Drivers & Buffers NB3N551DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

25 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.16 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

180 MHz

Trade Compliance

NB3N551DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-613-1632, 5962016131632

NIIN

016131632

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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