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NB3N2302DG

Onsemi

NB3N2302DG by Onsemi

NB3N2302DG clock driver by Onsemi has a propagation delay of 0.35 ns, operates at 3.3V, and supports up to 133 MHz frequency. Ideal for industrial applications requiring precise timing synchronization in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,568 parts In-Stock

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Digiode

USA . 1,850 parts In-Stock

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1,850

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Distributors (Availability)

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AZTECH Wire

Italy . 757 parts In-Stock

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$13.710

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757

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Component Stockers USA

USA . 600 parts In-Stock

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$99.990

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600

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SupplyDigital Components

Austria . 5,650 parts In-Stock

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Problanco Electronics

Mexico . 4,678 parts In-Stock

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TANS Electronics

Latvia . 2,740 parts In-Stock

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Corphita

USA . 1,380 parts In-Stock

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UHIMA Technologies

Türkiye . 485 parts In-Stock

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Microchip USA

USA . 481 parts In-Stock

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Corohmni

South Africa . 458 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 50 parts In-Stock

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Kulean Microsystems

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Overview

Enhance your clock signal accuracy and reliability with the NB3N2302DG by Onsemi, a leading manufacturer in clock drivers & buffers. Designed with precision and quality in mind, this product offers unparalleled performance in various applications. With a propagation delay of just 0.35 ns and a maximum operating temperature of 85 °C, this small outline package is perfect for industrial use. Trust Onsemi to deliver top-notch products that meet your needs and exceed your expectations. Upgrade your systems today with the NB3N2302DG and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to temperature fluctuations, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 0.35 ns

The low propagation delay ensures fast signal transmission, making this product suitable for applications requiring high-speed operation.

Surface Mount: YES

Being surface mountable makes installation easy and allows for space-efficient design layouts.

Nominal Supply Voltage / Vsup (V): 3.3

The standard nominal supply voltage of 3.3V makes this product compatible with many electronic systems and components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range of 85 °C ensures the product can withstand elevated temperatures in industrial environments.

Technical Specifications

Clock Drivers & Buffers NB3N2302DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

133 MHz

Trade Compliance

NB3N2302DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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