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NB3V1104CDTR2G

Onsemi

NB3V1104CDTR2G by Onsemi

NB3V1104CDTR2G clock driver by Onsemi features 14 terminals, 1.8V nominal voltage, and 3.5ns propagation delay. Ideal for industrial applications requiring a small outline package with 4 true outputs and a max operating temperature of 105°C.

Median Price

$1.717

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 9,397 parts In-Stock

1+ parts

$3.100

100+ parts

$1.913

1k+ parts

$1.699

10k+ parts

$1.613

9,397

$3.100

$1.913

$1.699

$1.613

Farnell

UK . 117,050 parts In-Stock

1+ parts

-

100+ parts

-

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$1.759

117,050

-

-

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$1.759

Rochester

USA . 97,050 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$1.340

10k+ parts

$1.260

97,050

-

$1.500

$1.340

$1.260

Verical

USA . 82,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

$1.575

82,050

-

-

$1.675

$1.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 442 parts In-Stock

1+ parts

$1.586

100+ parts

-

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442

$1.586

-

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.785

100+ parts

-

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1,000

$1.785

-

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Vyrian

USA . 65,440 parts In-Stock

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65,440

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Flip Electronics

USA . 62,500 parts In-Stock

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62,500

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Chip Stock

USA . 26,860 parts In-Stock

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26,860

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Sensible Micro Corp

USA . 1,953 parts In-Stock

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1,953

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Distributors (Availability)

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Ampacity Inc.

Singapore . 65,427 parts In-Stock

1+ parts

$1.420

100+ parts

-

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65,427

$1.420

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Corphita

USA . 1,634 parts In-Stock

1+ parts

$1.503

100+ parts

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1,634

$1.503

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$1.551

100+ parts

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289

$1.551

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.785

100+ parts

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500

$1.785

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Argo Parts USA

USA . 107 parts In-Stock

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$1.785

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107

$1.785

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Continental Prestige Electronics

USA . 117,050 parts In-Stock

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$2.200

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117,050

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$2.200

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 7,245 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,010 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Kepictronics

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,659 parts In-Stock

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4,659

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TANS Electronics

Latvia . 3,675 parts In-Stock

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3,675

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SupplyDigital Components

Austria . 1,011 parts In-Stock

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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227

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Formix International (Excess)

India . 145 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 17 parts In-Stock

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17

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Overview

Enhance your electronic devices with the NB3V1104CDTR2G by Onsemi, a top-quality clock driver and buffer that guarantees reliable performance. Onsemi is renowned for its cutting-edge technology and precision engineering, ensuring that this product meets the highest standards of excellence. Ideal for a wide range of applications, this clock driver offers seamless integration, fast propagation delay, and 3-state output characteristics. Trust Onsemi to deliver unmatched value and efficiency, revolutionizing your electronic designs with the NB3V1104CDTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external factors, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort in the assembly process.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, which helps in reducing power consumption and improving overall energy efficiency.

Propagation Delay (tpd): 3.5 ns

Low propagation delay ensures fast signal transmission, making this product ideal for applications requiring quick response times.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for reliable performance in harsh conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures functionality in extreme cold environments, increasing the versatility of this product.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

No. of True Outputs: 4

Multiple true outputs allow for driving multiple clock signals, providing flexibility in system design and functionality.

Technical Specifications

Clock Drivers & Buffers NB3V1104CDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

14

No. of True Outputs:

4

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1104CDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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