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NB3V8312CMNG

Onsemi

NB3V8312CMNG by Onsemi

NB3V8312CMNG clock driver by Onsemi features 32 terminals, 12 true outputs, and a propagation delay of 4.2 ns. Ideal for industrial applications requiring a clock buffer with a max operating temperature of 85°C and output characteristics of 3-STATE WITH SERIES RESISTOR.

Median Price

$5.359

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$9.470

100+ parts

$5.020

1k+ parts

$4.690

10k+ parts

$4.210

8

$9.470

$5.020

$4.690

$4.210

Mouser Electronics

USA . 257 parts In-Stock

1+ parts

$10.100

100+ parts

$6.200

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$6.200

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Flip Electronics (Authorized)

USA . 42,394 parts In-Stock

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DigiKey

USA . 17,160 parts In-Stock

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$4.290

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$4.290

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Rochester

USA . 253 parts In-Stock

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-

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$4.630

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$4.140

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$3.900

253

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$4.630

$4.140

$3.900

Verical

USA . 253 parts In-Stock

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$6.088

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$6.088

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Arrow

USA . 140 parts In-Stock

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$4.035

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$3.995

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$4.035

$3.995

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Distributors (In-Stock)

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Digiode

USA . 2,304 parts In-Stock

1+ parts

$4.902

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2,304

$4.902

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Nova Conductors

Japan . 50 parts In-Stock

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$5.017

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50

$5.017

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Flip Electronics

USA . 12,364 parts In-Stock

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Vyrian

USA . 5,776 parts In-Stock

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SPM Sales

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Ampacity Inc.

Singapore . 8,149 parts In-Stock

1+ parts

$3.650

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8,149

$3.650

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Corphita

USA . 2,484 parts In-Stock

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$4.644

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2,484

$4.644

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Continental Prestige Electronics

USA . 4,807 parts In-Stock

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$5.017

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$4.917

4,807

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$4.917

Netroflash

USA . 100 parts In-Stock

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$5.017

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$5.017

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Corohmni

South Africa . 210 parts In-Stock

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$5.160

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$5.160

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Microchip USA

USA . 1,029 parts In-Stock

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$26.236

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$26.236

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iodParts Technologies Inc.

India . 17,316 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,771 parts In-Stock

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Kulean Microsystems

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QUARKTWIN TECHNOLOGY LTD

USA . 2,483 parts In-Stock

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Argo Parts USA

USA . 1,696 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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SupplyDigital Components

Austria . 791 parts In-Stock

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Kepictronics

USA . 632 parts In-Stock

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TANS Electronics

Latvia . 411 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Problanco Electronics

Mexico . 37 parts In-Stock

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UHIMA Technologies

Türkiye . 32 parts In-Stock

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Overview

Elevate your clock driving and buffering capabilities with the NB3V8312CMNG by Onsemi. Crafted by a trusted manufacturer, this product falls under the Clock Drivers & Buffers category and boasts surface mount technology and standard input conditioning for seamless integration. With 32 terminals and a compact square package shape, this chip carrier offers a nominal supply voltage of 1.8V and a propagation delay of just 4.2 ns. Perfect for industrial applications, the NB3V8312CMNG ensures reliable performance in extreme temperatures, ranging from -40 to 85°C. Experience the value and benefits of this high-quality product today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a common and stable supply voltage, making it compatible with a wide range of systems.

Propagation Delay (tpd): 4.2 ns

Low propagation delay ensures fast and accurate signal processing, essential for clock drivers in high-speed applications.

Maximum Operating Temperature: 85 °C

Can operate reliably in a wide range of temperature conditions, suitable for industrial applications.

No. of True Outputs: 12

Provides multiple output signals, allowing for versatility and flexibility in clock signal distribution.

Minimum fmax: 250 MHz

High maximum frequency capability ensures compatibility with modern high-speed systems and applications.

Technical Specifications

Clock Drivers & Buffers NB3V8312CMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V, 3.3V SUPPLY VOLTAGE

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.2 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V8312CMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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