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NB3V8312CFAG

Onsemi

NB3V8312CFAG by Onsemi

NB3V8312CFAG clock driver by Onsemi features 12 true outputs with a min frequency of 250 MHz. With a propagation delay of 4.2 ns, it operates in industrial temperatures from -40 to 85°C. This device is ideal for applications requiring precise timing and synchronization in electronic systems.

Median Price

$8.474

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,454 parts In-Stock

1+ parts

$10.194

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2,454

$10.194

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Vyrian

USA . 5,331 parts In-Stock

1+ parts

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5,331

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Flip Electronics

USA . 3,500 parts In-Stock

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3,500

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IBS Electronics

USA . 250 parts In-Stock

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-

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$6.755

10k+ parts

$6.682

250

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-

$6.755

$6.682

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,209 parts In-Stock

1+ parts

$9.657

100+ parts

-

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1,209

$9.657

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$9.670

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156

$9.670

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Microchip USA

USA . 1,880 parts In-Stock

1+ parts

$28.448

100+ parts

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1,880

$28.448

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A-Z Elektronik GmbH

Germany . 6,866 parts In-Stock

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6,866

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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6,000

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TANS Electronics

Latvia . 5,980 parts In-Stock

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5,980

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Problanco Electronics

Mexico . 5,783 parts In-Stock

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5,783

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Perfect Parts

USA . 1,400 parts In-Stock

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1,400

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Kulean Microsystems

USA . 1,189 parts In-Stock

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1,189

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SupplyDigital Components

Austria . 516 parts In-Stock

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516

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Eastek

USA . 500 parts In-Stock

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$10.440

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500

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$10.440

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UHIMA Technologies

Türkiye . 256 parts In-Stock

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256

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Overview

Enhance the performance of your electronic devices with the NB3V8312CFAG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality clock drivers & buffers that are essential for various applications. With a focus on reliability and precision, this product offers customers unmatched value and benefits. Ensure seamless operation and improved efficiency with the NB3V8312CFAG, making it the ideal choice for your electronic needs. Trust in Onsemi to provide you with cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and thermal properties, making the product suitable for a variety of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V ensures efficient power consumption and compatibility with a wide range of systems.

Propagation Delay (tpd): 4.2 ns

Low propagation delay of 4.2 ns ensures fast signal processing, making the product suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making it ideal for industrial applications.

Minimum Supply Voltage (Vsup): 1.6 V

Ability to operate at a minimum supply voltage of 1.6V provides flexibility and compatibility with low-power systems.

Minimum fmax: 250 MHz

High maximum frequency capability of 250 MHz allows for quick data transmission and processing, making the product suitable for high-performance applications.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates that the product is sensitive to moisture but has a moderate level of protection, making it suitable for standard handling and storage procedures.

Technical Specifications

Clock Drivers & Buffers NB3V8312CFAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V, 3.3V SUPPLY VOLTAGE

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.2 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V8312CFAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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