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NB3V1102CDTR2G

Onsemi

NB3V1102CDTR2G by Onsemi

NB3V1102CDTR2G clock driver by Onsemi features 3.5ns propagation delay, 250MHz min fmax, and 105°C max operating temp. Ideal for industrial applications requiring clock signal distribution in a compact form factor with 8 terminals and 1.8V nominal voltage.

Median Price

$4.295

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,401 parts In-Stock

1+ parts

$2.610

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2,401

$2.610

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Chip1Stop

Japan . 2,420 parts In-Stock

1+ parts

$3.190

100+ parts

$2.853

1k+ parts

$2.671

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-

2,420

$3.190

$2.853

$2.671

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Mouser Electronics

USA . 1,607 parts In-Stock

1+ parts

$5.400

100+ parts

$3.460

1k+ parts

$3.060

10k+ parts

$3.010

1,607

$5.400

$3.460

$3.060

$3.010

DigiKey

USA . 1,275 parts In-Stock

1+ parts

$5.400

100+ parts

$3.457

1k+ parts

$3.106

10k+ parts

$3.019

1,275

$5.400

$3.457

$3.106

$3.019

Verical

USA . 2,401 parts In-Stock

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2,401

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Digiode

USA . 1,148 parts In-Stock

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$3.030

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1,148

$3.030

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Vyrian

USA . 343 parts In-Stock

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$3.190

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343

$3.190

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Chip Stock

USA . 11,068 parts In-Stock

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11,068

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,316 parts In-Stock

1+ parts

$2.710

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-

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2,316

$2.710

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Corphita

USA . 226 parts In-Stock

1+ parts

$2.871

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226

$2.871

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Corohmni

South Africa . 189 parts In-Stock

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$3.190

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189

$3.190

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Microchip USA

USA . 4,493 parts In-Stock

1+ parts

$20.440

100+ parts

$20.310

1k+ parts

$20.250

10k+ parts

$20.190

4,493

$20.440

$20.310

$20.250

$20.190

Lixinc

USA . 15,130 parts In-Stock

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Perfect Parts

USA . 10,497 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,684 parts In-Stock

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5,684

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TANS Electronics

Latvia . 5,384 parts In-Stock

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Kulean Microsystems

USA . 3,440 parts In-Stock

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GreenTree Electronics

Israel . 2,368 parts In-Stock

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2,368

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Authorized Procurement Solutions

USA . 2,268 parts In-Stock

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2,268

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SupplyDigital Components

Austria . 1,939 parts In-Stock

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Futuretech Components

Singapore . 708 parts In-Stock

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708

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Problanco Electronics

Mexico . 500 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the NB3V1102CDTR2G by Onsemi - a clock driver & buffer like no other. Crafted with precision and expertise by Onsemi, this product guarantees top-notch quality and reliability. Ideal for a wide range of applications, this clock driver & buffer offers seamless performance and efficiency. Trust Onsemi to deliver excellence in every aspect of their products, providing you with the value and benefits you deserve. Upgrade your electronics with the NB3V1102CDTR2G today and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and space.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, increasing the versatility of the product.

Propagation Delay: 3.5 ns

With a fast propagation delay of 3.5 ns, this clock driver allows for quick and efficient data transmission within the circuit.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures reliable performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows the driver to switch between high impedance, logic 0, and logic 1 outputs, providing flexibility in controlling connected devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the driver can function effectively in cold environments.

Maximum Same Edge Skew: 0.075 ns

The low maximum same edge skew of 0.075 ns ensures that the outputs of the driver are synchronized, preventing signal distortion and delay.

Technical Specifications

Clock Drivers & Buffers NB3V1102CDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

Family:

NB3V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.5 ns

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

250 MHz

Trade Compliance

NB3V1102CDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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