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ZL40234LDF1

Microchip Technology

ZL40234LDF1 by Microchip Technology

ZL40234LDF1 by Microchip Technology is a clock driver & buffer with surface mount capability. It has a differential mux input conditioning and 1 function. With a square package, it operates at a nominal voltage of 2.5V and has a propagation delay of 2.07ns. Its compact size (5mm x 5mm) makes it suitable for various industrial applications requiring high frequency performance up to 1600MHz.

Median Price

$6.222

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$6.222

100+ parts

-

1k+ parts

-

10k+ parts

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26

$6.222

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-

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Vyrian

USA . 190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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190

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,029 parts In-Stock

1+ parts

$5.251

100+ parts

-

1k+ parts

$5.041

10k+ parts

$5.041

4,029

$5.251

-

$5.041

$5.041

Continental Prestige Electronics

USA . 5,647 parts In-Stock

1+ parts

$6.222

100+ parts

-

1k+ parts

-

10k+ parts

$6.098

5,647

$6.222

-

-

$6.098

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.222

100+ parts

-

1k+ parts

-

10k+ parts

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100

$6.222

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-

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AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$6.384

100+ parts

-

1k+ parts

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10k+ parts

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601

$6.384

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Aztec Data Supply Inc.

USA . 75 parts In-Stock

1+ parts

$8.019

100+ parts

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1k+ parts

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75

$8.019

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Corohmni

South Africa . 84 parts In-Stock

1+ parts

$15.038

100+ parts

-

1k+ parts

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10k+ parts

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84

$15.038

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$36.274

100+ parts

$33.009

1k+ parts

$29.745

10k+ parts

-

2,500

$36.274

$33.009

$29.745

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Ampacity Inc.

Singapore . 304 parts In-Stock

1+ parts

$54.000

100+ parts

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304

$54.000

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Fulton Briggs Corp.

USA . 6,270 parts In-Stock

1+ parts

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100+ parts

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6,270

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Argo Parts USA

USA . 4,607 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,607

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QUARKTWIN TECHNOLOGY LTD

USA . 2,617 parts In-Stock

1+ parts

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100+ parts

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2,617

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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Overview

Experience the next level of precision and reliability with the ZL40234LDF1 clock driver by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and unparalleled performance. This clock driver is designed to excel in a wide range of applications, providing exceptional signal conditioning and differential multiplexing capabilities. With its compact square package and very thin profile, it offers easy installation and space-saving solutions. Delve into the world of seamless operations with the ZL40234LDF1 and unlock a myriad of benefits and advantages for your projects. Upgrade your systems today and experience the difference.

Feature Benefit Bullets

Surface Mount: YES

This clock driver & buffer is surface mountable, allowing for easy and efficient integration into electronic devices or circuit boards.

Input Conditioning: DIFFERENTIAL MUX

The differential multiplexer input conditioning of this clock driver & buffer provides enhanced signal integrity and accuracy, making it suitable for demanding applications.

No. of Functions: 1

With a single function, this clock driver & buffer simplifies circuit design and reduces the complexity of the overall system.

Package Shape: SQUARE

The square package shape offers space-efficient utilization, making it ideal for compact designs and applications with limited board space.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage ensures compatibility with standard power supplies, facilitating ease of integration into existing systems.

Load Capacitance (CL): 1 pF

The 1pF load capacitance allows for efficient driving of connected loads, resulting in improved signal transmission and reliability.

No. of Terminals: 32

With 32 terminals, this clock driver & buffer provides ample connectivity options and versatility in controlling multiple clocks or signals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, featuring a heat sink/slug and a very thin profile, enhances thermal dissipation and ease of installation in space-constrained environments.

Propagation Delay (tpd): 2.07 ns

The low propagation delay of 2.07 ns ensures fast and accurate signal transmission, minimizing timing errors and improving overall system performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this clock driver & buffer can reliably function under demanding temperature conditions.

Minimum Operating Temperature: -40 °C

The clock driver & buffer's ability to operate down to -40°C enables reliable performance in harsh and extreme environments.

Terminal Position: QUAD

The quad terminal position facilitates easy and efficient soldering, enabling secure connections and reducing assembly time.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this clock driver & buffer allows for low-profile system designs, accommodating space-constrained applications.

Width: 5 mm

The compact width of 5 mm makes this clock driver & buffer suitable for compact device designs, optimizing space utilization.

Minimum Supply Voltage (Vsup): 2.375 V

The minimum supply voltage of 2.375V ensures the clock driver & buffer's compatibility with a wide range of power sources, enhancing flexibility in system integration.

Length: 5 mm

The length of 5 mm further contributes to the compact form factor of this clock driver & buffer, making it suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

This clock driver & buffer's industrial temperature grade rating ensures reliable operation even in rugged industrial environments.

Technology: CMOS

The CMOS technology employed in this clock driver & buffer enables low power consumption, high noise immunity, and compatibility with a broad range of devices and systems.

Terminal Form: NO LEAD

The lead-free terminal form of this clock driver & buffer complies with environmental regulations and supports the production of eco-friendly electronic products.

Packing Method: TR

The TR packing method provides convenient and reliable shipment and storage of the clock driver & buffer, ensuring safe and efficient logistics.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for precise alignment during soldering, ensuring secure connections and reliable signal transmission.

Maximum Same Edge Skew (tskwd): 0.04 ns

With a maximum same edge skew of 0.04 ns, this clock driver & buffer ensures accurate and synchronized signal transmission, minimizing timing discrepancies.

No. of True Outputs: 4

This clock driver & buffer features four true output signals, offering extensive compatibility and flexibility in driving multiple loads or devices.

Minimum fmax: 1600 MHz

The clock driver & buffer's minimum fmax rating of 1600 MHz allows for high-speed signal processing and compatibility with advanced digital systems.

Maximum Supply Voltage (Vsup): 2.625 V

With a maximum supply voltage of 2.625V, this clock driver & buffer can accommodate a range of power sources, ensuring compatibility with diverse system requirements.

Maximum Power Supply Current (ICC): 197 mA

The clock driver & buffer's maximum power supply current of 197 mA supports the driving of various loads, enabling efficient and reliable signal amplification and distribution.

Technical Specifications

Clock Drivers & Buffers ZL40234LDF1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

HAS ULTRA-LOW ADDITIVE JITTER LVCMOS OUTPUT; ALSO OPERATES AT 3.3 V SUPPLY

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Load Capacitance (CL):

1 pF

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

197 mA

Propagation Delay (tpd):

2.07 ns

Maximum Same Edge Skew (tskwd):

.04 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Minimum fmax:

1600 MHz

Trade Compliance

ZL40234LDF1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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