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ZL40221LDG1

Microchip Technology

ZL40221LDG1 by Microchip Technology

ZL40221LDG1 Clock Driver by Microchip: 32 terminals, 2.5V supply, 2ns propagation delay. Ideal for industrial applications requiring differential mux input conditioning in a compact square package with quad terminal position and low skew output.

Median Price

$5.248

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.248

100+ parts

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1k+ parts

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100

$5.248

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Vyrian

USA . 478 parts In-Stock

1+ parts

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478

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 9 parts In-Stock

1+ parts

$5.248

100+ parts

-

1k+ parts

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10k+ parts

$5.143

9

$5.248

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-

$5.143

Andel Nordic

Denmark . 4,371 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

$7.488

10k+ parts

$7.488

4,371

$7.800

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$7.488

$7.488

Ampacity Inc.

Singapore . 429 parts In-Stock

1+ parts

$8.000

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429

$8.000

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AZTECH Wire

Italy . 420 parts In-Stock

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$18.968

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420

$18.968

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Perfect Parts

USA . 2,744 parts In-Stock

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2,744

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Argo Parts USA

USA . 2,729 parts In-Stock

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2,729

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Marpe Global Electronics

Taiwan . 2,498 parts In-Stock

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2,498

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QualityLine Systems

Poland . 2,498 parts In-Stock

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2,498

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XL Components Corporation

Australia . 2,498 parts In-Stock

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2,498

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$5.143

1k+ parts

$4.985

10k+ parts

$4.881

50

-

$5.143

$4.985

$4.881

Overview

Elevate your clock signal synchronization with the ZL40221LDG1 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch Clock Drivers & Buffers designed to optimize performance and efficiency. With differential mux input conditioning and a compact square package shape, this product offers unparalleled reliability and precision. Ideal for industrial applications, the ZL40221LDG1 boasts a fast propagation delay of 2 ns and a wide operating temperature range. Experience seamless integration and enhanced functionality with this cutting-edge solution from Microchip Technology.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a surface, making it convenient for assembly and integration into various electronic devices.

Input Conditioning: DIFFERENTIAL MUX

The differential multiplexer input conditioning allows for precise and reliable signal processing, ensuring accurate clock distribution.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V provides efficient power consumption while maintaining optimal performance.

Propagation Delay (tpd): 2 ns

With a fast propagation delay of 2 ns, this product enables quick synchronization of clock signals in electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this product suitable for a wide range of temperature conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the clock driver.

Maximum Seated Height: 1 mm

The compact maximum seated height of 1 mm allows for space-saving design and efficient use of board space in electronic applications.

Technical Specifications

Clock Drivers & Buffers ZL40221LDG1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TRAY

Propagation Delay (tpd):

2 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ZL40221LDG1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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