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MC100LVEP11DR2G

Onsemi

MC100LVEP11DR2G by Onsemi

MC100LVEP11DR2G clock driver by Onsemi features a propagation delay of 0.31 ns, operates at a nominal voltage of 2.5 V, and has a max power supply current of 50 mA. This ECL technology device is ideal for applications requiring differential input conditioning and surface mount installation in industrial temperature environments.

Median Price

$4.810

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,850 parts In-Stock

1+ parts

$6.310

100+ parts

$4.077

1k+ parts

$3.675

10k+ parts

$3.575

4,850

$6.310

$4.077

$3.675

$3.575

Rochester

USA . 2,035 parts In-Stock

1+ parts

-

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$3.310

1k+ parts

$2.960

10k+ parts

$2.780

2,035

-

$3.310

$2.960

$2.780

Distributors (In-Stock)

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Digiode

USA . 1,324 parts In-Stock

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$3.496

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$3.496

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Vyrian

USA . 8,763 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6,117 parts In-Stock

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Speed Components Ltd

Israel . 692 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Inventory MP

USA . 284 parts In-Stock

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284

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Bristol Electronics

USA . 284 parts In-Stock

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284

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,177 parts In-Stock

1+ parts

$3.130

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1,177

$3.130

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Corphita

USA . 2,380 parts In-Stock

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$3.312

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$3.312

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Corohmni

South Africa . 139 parts In-Stock

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$3.680

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139

$3.680

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Aztec Data Supply Inc.

USA . 1,610 parts In-Stock

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$31.750

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$31.750

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Metaverse IC Inc.

Canada . 32,650 parts In-Stock

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Perfect Parts

USA . 14,498 parts In-Stock

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RC Electronics

USA . 6,017 parts In-Stock

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TANS Electronics

Latvia . 5,781 parts In-Stock

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Lixinc

USA . 5,659 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,358 parts In-Stock

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Microchip USA

USA . 4,802 parts In-Stock

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Argo Parts USA

USA . 4,532 parts In-Stock

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Problanco Electronics

Mexico . 3,901 parts In-Stock

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SupplyDigital Components

Austria . 3,870 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 2,583 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Kulean Microsystems

USA . 1,818 parts In-Stock

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Continental Prestige Electronics

USA . 1,486 parts In-Stock

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Assy Fe

Spain . 1,237 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 449 parts In-Stock

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Overview

Enhance the performance of your clock drivers and buffers with the MC100LVEP11DR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and precision. Ideal for various applications, this clock driver offers unmatched value with its fast propagation delay and differential input conditioning. Experience seamless operation and enhanced efficiency with the MC100LVEP11DR2G, setting new standards in clock driver technology. Elevate your systems with Onsemi's innovative solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.36 ns

Low propagation delay ensures fast and efficient operation of the clock driver, leading to timely and accurate signals.

Surface Mount: YES

Surface mount technology makes installation and PCB assembly easier and more efficient.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise, ensuring reliable data transmission and reception.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage ensures consistent performance of the clock driver under various operating conditions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows the clock driver to function effectively in various environments.

Technology: ECL

ECL technology offers high-speed and low-power consumption, making the clock driver efficient and reliable.

Technical Specifications

Clock Drivers & Buffers MC100LVEP11DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.36 ns

Propagation Delay (tpd):

.31 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100LVEP11DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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