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MC10EP11DG

Onsemi

MC10EP11DG by Onsemi

MC10EP11DG clock driver by Onsemi features a propagation delay of 0.32 ns, operates at a nominal voltage of 3.3V, and offers differential input conditioning. This ECL technology device is ideal for applications requiring precise timing synchronization in industrial settings with an operating temperature range from -40°C to 85°C.

Median Price

$6.445

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 163 parts In-Stock

1+ parts

$6.270

100+ parts

$6.140

1k+ parts

$6.020

10k+ parts

-

163

$6.270

$6.140

$6.020

-

DigiKey

USA . 59 parts In-Stock

1+ parts

$9.220

100+ parts

$6.104

1k+ parts

$5.634

10k+ parts

$5.522

59

$9.220

$6.104

$5.634

$5.522

Chip1Stop

Japan . 132 parts In-Stock

1+ parts

$9.531

100+ parts

$6.560

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-

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132

$9.531

$6.560

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Verical

USA . 12,446 parts In-Stock

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-

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$5.070

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12,446

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$5.070

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Flip Electronics (Authorized)

USA . 3,626 parts In-Stock

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3,626

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Avnet

USA . 980 parts In-Stock

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-

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$6.620

1k+ parts

$5.370

10k+ parts

$5.030

980

-

$6.620

$5.370

$5.030

Arrow

USA . 326 parts In-Stock

1+ parts

-

100+ parts

$5.417

1k+ parts

$5.120

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326

-

$5.417

$5.120

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Distributors (In-Stock)

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Digiode

USA . 2,477 parts In-Stock

1+ parts

$5.956

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-

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2,477

$5.956

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Flip Electronics

USA . 10,388 parts In-Stock

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10,388

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Vyrian

USA . 4,030 parts In-Stock

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4,030

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Cyclops Electronics Ltd

UK . 348 parts In-Stock

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348

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Nova Conductors

Japan . 73 parts In-Stock

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73

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Distributors (Availability)

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Benley Electronics

USA . 22 parts In-Stock

1+ parts

$0.450

100+ parts

-

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22

$0.450

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Ampacity Inc.

Singapore . 632 parts In-Stock

1+ parts

$5.330

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632

$5.330

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Semicontronic

India . 475 parts In-Stock

1+ parts

$5.330

100+ parts

$5.197

1k+ parts

$5.170

10k+ parts

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475

$5.330

$5.197

$5.170

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Corphita

USA . 1,359 parts In-Stock

1+ parts

$5.643

100+ parts

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1,359

$5.643

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Corohmni

South Africa . 280 parts In-Stock

1+ parts

$6.270

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280

$6.270

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Component Stockers USA

USA . 1,521 parts In-Stock

1+ parts

$8.610

100+ parts

$6.090

1k+ parts

-

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1,521

$8.610

$6.090

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Aztec Data Supply Inc.

USA . 1,305 parts In-Stock

1+ parts

$27.249

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-

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1,305

$27.249

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Microchip USA

USA . 1,036 parts In-Stock

1+ parts

$28.480

100+ parts

$28.070

1k+ parts

$27.870

10k+ parts

$27.660

1,036

$28.480

$28.070

$27.870

$27.660

Lixinc

USA . 7,322 parts In-Stock

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7,322

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Continental Prestige Electronics

USA . 5,905 parts In-Stock

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RC Electronics

USA . 5,034 parts In-Stock

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$6.680

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$6.100

10k+ parts

$5.920

5,034

-

$6.680

$6.100

$5.920

QUARKTWIN TECHNOLOGY LTD

USA . 4,110 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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TANS Electronics

Latvia . 2,536 parts In-Stock

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SupplyDigital Components

Austria . 2,338 parts In-Stock

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Problanco Electronics

Mexico . 1,270 parts In-Stock

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Perfect Parts

USA . 1,062 parts In-Stock

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Metaverse IC Inc.

Canada . 786 parts In-Stock

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786

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Kulean Microsystems

USA . 769 parts In-Stock

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769

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Argo Parts USA

USA . 729 parts In-Stock

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UHIMA Technologies

Türkiye . 104 parts In-Stock

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104

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GreenTree Electronics

Israel . 91 parts In-Stock

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Kepictronics

USA . 48 parts In-Stock

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48

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance the performance of your clocking systems with the MC10EP11DG clock driver and buffer by Onsemi. This high-quality product offers precise signal conditioning and ultra-fast propagation delay, ensuring seamless operation in industrial-grade applications. With its small outline package and differential inputs, this versatile component is ideal for a wide range of electronic devices. Trust Onsemi's reputation for reliability and innovation to deliver exceptional value and performance for all your clocking needs. Upgrade your designs today with the MC10EP11DG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the clock driver, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 0.32 ns

With a fast propagation delay, this clock driver can efficiently synchronize signals in a timely manner, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort during the manufacturing process.

Input Conditioning: DIFFERENTIAL

The use of differential input conditioning helps in reducing noise and improving signal integrity, leading to more accurate clock signal generation.

Nominal Supply Voltage / Vsup (V): 3.3

With a 3.3V supply voltage, this clock driver is compatible with a wide range of systems and can be easily integrated into existing circuits.

No. of Terminals: 8

Having 8 terminals allows for multiple input and output connections, enabling the clock driver to interface with various components in a system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock driver can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures that the clock driver remains functional even in extreme cold environments.

Peak Reflow Temperature °C: 260

The clock driver can undergo reflow soldering at a high temperature of 260°C, ensuring secure and reliable connections during the manufacturing process.

Technology: ECL

Using Emitter-Coupled Logic technology allows for high-speed operation and low power consumption, making this clock driver suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers MC10EP11DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V

Family:

10EP

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.12 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EP11DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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