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NB3F8L3010CMNR4G

Onsemi

NB3F8L3010CMNR4G by Onsemi

NB3F8L3010CMNR4G clock driver by Onsemi features 32 terminals, operates at -40 to 85°C, with a supply voltage range of 2.375-2.625V. It offers 10 true outputs, differential mux input conditioning, and a max frequency of 10MHz. Ideal for industrial applications requiring precise clock signal distribution in compact spaces.

Median Price

$4.774

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 620 parts In-Stock

1+ parts

$8.560

100+ parts

$4.980

1k+ parts

$4.110

10k+ parts

-

620

$8.560

$4.980

$4.110

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Chip1Stop

Japan . 640 parts In-Stock

1+ parts

$25.400

100+ parts

$10.600

1k+ parts

$7.970

10k+ parts

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640

$25.400

$10.600

$7.970

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Farnell

UK . 535,680 parts In-Stock

1+ parts

-

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$4.437

10k+ parts

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535,680

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-

$4.437

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Rochester

USA . 535,630 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

535,630

-

$4.070

$3.640

$3.420

Verical

USA . 481,921 parts In-Stock

1+ parts

-

100+ parts

$5.063

1k+ parts

$4.525

10k+ parts

$4.263

481,921

-

$5.063

$4.525

$4.263

Flip Electronics (Authorized)

USA . 154,332 parts In-Stock

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154,332

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DigiKey

USA . 1,000 parts In-Stock

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-

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$4.485

10k+ parts

$4.393

1,000

-

-

$4.485

$4.393

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,379 parts In-Stock

1+ parts

$4.284

100+ parts

-

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1,379

$4.284

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-

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Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$4.651

100+ parts

-

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37

$4.651

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Vyrian

USA . 243,895 parts In-Stock

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243,895

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Flip Electronics

USA . 157,764 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 244,087 parts In-Stock

1+ parts

$3.450

100+ parts

-

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244,087

$3.450

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Corphita

USA . 2,170 parts In-Stock

1+ parts

$4.059

100+ parts

-

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2,170

$4.059

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Corohmni

South Africa . 389 parts In-Stock

1+ parts

$4.431

100+ parts

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389

$4.431

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$16.256

100+ parts

$14.793

1k+ parts

$13.330

10k+ parts

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200

$16.256

$14.793

$13.330

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Microchip USA

USA . 3,414 parts In-Stock

1+ parts

$30.230

100+ parts

$30.040

1k+ parts

$29.950

10k+ parts

$29.860

3,414

$30.230

$30.040

$29.950

$29.860

Continental Prestige Electronics

USA . 361,759 parts In-Stock

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361,759

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A-Z Elektronik GmbH

Germany . 6,797 parts In-Stock

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Perfect Parts

USA . 4,547 parts In-Stock

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4,547

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SupplyDigital Components

Austria . 4,201 parts In-Stock

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TANS Electronics

Latvia . 4,116 parts In-Stock

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Problanco Electronics

Mexico . 3,138 parts In-Stock

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Kulean Microsystems

USA . 2,013 parts In-Stock

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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Futuretech Components

Singapore . 708 parts In-Stock

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Argo Parts USA

USA . 206 parts In-Stock

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Kepictronics

USA . 95 parts In-Stock

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95

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Overview

Unleash the power of precision with the NB3F8L3010CMNR4G by Onsemi. Crafted with excellence, this clock driver & buffer offers unparalleled quality and reliability, making it a standout choice for various applications. From differential mux input conditioning to 3-state output characteristics, this chip carrier package delivers exceptional performance in industrial settings. With a nominal supply voltage of 2.5V and maximum operating temperature of 85°C, this product ensures optimal functionality while maximizing efficiency. Elevate your projects with the Onsemi NB3F8L3010CMNR4G - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the clock driver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a commonly used voltage level, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Designed to function efficiently even in high-temperature environments, improving overall performance and longevity.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, making it suitable for diverse application scenarios.

Minimum Supply Voltage (Vsup): 2.375 V

Works reliably even at low supply voltages, ensuring consistent operation under varying conditions.

Maximum Power Supply Current (ICC): 50 mA

Consumes low power, leading to energy efficiency and reducing overall operating costs.

Technical Specifications

Clock Drivers & Buffers NB3F8L3010CMNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3F

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3,2.5/3.3

Maximum Power Supply Current (ICC):

50 mA

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.055 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

10 MHz

Trade Compliance

NB3F8L3010CMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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