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NB3F8L3010CTR2G

Onsemi

NB3F8L3010CTR2G by Onsemi

NB3F8L3010CTR2G Clock Driver by Onsemi features 32 terminals, operates at -40 to 85 °C, with a supply voltage range of 1.5/3.3V and output characteristics in 3-STATE mode. Ideal for applications requiring differential mux input conditioning and a max frequency of 200 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,769 parts In-Stock

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Vyrian

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Problanco Electronics

Mexico . 6,420 parts In-Stock

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SupplyDigital Components

Austria . 2,010 parts In-Stock

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Kulean Microsystems

USA . 1,228 parts In-Stock

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Corphita

USA . 855 parts In-Stock

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UHIMA Technologies

Türkiye . 574 parts In-Stock

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Corohmni

South Africa . 349 parts In-Stock

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TANS Electronics

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Overview

Discover the ultimate clock driver and buffer, the NB3F8L3010CTR2G by Onsemi. With a reputation for top-tier manufacturing, this product guarantees precision and reliability in any application. Whether you're in need of differential mux input conditioning or 3-state output characteristics, this chip carrier boasts unrivaled performance. Trust in Onsemi to deliver quality solutions that exceed expectations. Elevate your projects with the NB3F8L3010CTR2G and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and space.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer for input conditioning ensures accurate signal processing and minimizes noise interference.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage is commonly used in many electronic systems, making this clock driver compatible with a wide range of applications.

Package Shape: SQUARE

The square package shape offers a compact design and better utilization of space on the circuit board.

No. of True Outputs: 10

With 10 true outputs, this clock driver can drive multiple components simultaneously, enhancing the overall performance of the system.

Minimum fmax: 200 MHz

The minimum operating frequency of 200MHz ensures high-speed operation, making this clock driver suitable for applications requiring fast signal processing.

Technical Specifications

Clock Drivers & Buffers NB3F8L3010CTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

3F

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.5/3.3,2.5/3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.055 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Minimum fmax:

200 MHz

Trade Compliance

NB3F8L3010CTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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