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NB3F8L3010CG

Onsemi

NB3F8L3010CG by Onsemi

NB3F8L3010CG clock driver by Onsemi features 32 terminals, operates at -40 to 85 °C, with a supply voltage range of 2.375-2.625V. It offers 10 true outputs, differential mux input conditioning, and a max frequency of 200MHz. Ideal for industrial applications requiring precise clock signal distribution in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,175 parts In-Stock

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Vyrian

USA . 1,933 parts In-Stock

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1,933

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Kulean Microsystems

USA . 6,461 parts In-Stock

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6,461

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TANS Electronics

Latvia . 5,132 parts In-Stock

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Problanco Electronics

Mexico . 2,184 parts In-Stock

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Corphita

USA . 1,816 parts In-Stock

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SupplyDigital Components

Austria . 1,020 parts In-Stock

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UHIMA Technologies

Türkiye . 900 parts In-Stock

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900

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Enhance your electronic design projects with the NB3F8L3010CG clock driver by Onsemi. Known for its superior quality and reliability, Onsemi offers a wide range of clock drivers and buffers that cater to various applications. The NB3F8L3010CG, with its differential mux input conditioning and 3-state output characteristics, provides unmatched performance and precision. Whether you're working on industrial-grade equipment or consumer electronics, this product ensures optimal functionality and efficiency. Elevate your designs with Onsemi's clock drivers and experience the difference in performance and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer for input conditioning ensures accurate and reliable data processing, making this product suitable for applications where precision is crucial.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage is common in many electronic systems, making this clock driver compatible with a wide range of devices.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade range of -40 to 85 °C, this clock driver is designed to withstand harsh operating conditions, ensuring high reliability and performance in industrial environments.

Minimum fmax: 200 MHz

The clock driver has a high minimum operating frequency of 200 MHz, making it suitable for high-speed applications where fast data processing is essential.

Technical Specifications

Clock Drivers & Buffers NB3F8L3010CG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

3F

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.5/3.3,2.5/3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.055 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Minimum fmax:

200 MHz

Trade Compliance

NB3F8L3010CG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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