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CY2309SXC-1H

Infineon Technologies

CY2309SXC-1H by Infineon Technologies

CY2309SXC-1H clock driver by Infineon operates at 3.3V, with 8 true outputs and a max frequency of 133.33MHz. It features a propagation delay of 8.7ns, suitable for commercial temperature grade applications in small outline packages.

Median Price

$4.390

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,259 parts In-Stock

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$3.490

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$3.420

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$3.350

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$3.490

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Arrow

USA . 3 parts In-Stock

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$4.213

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$3.649

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$3.603

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3

$4.213

$3.649

$3.603

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Chip1Stop

Japan . 2 parts In-Stock

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$4.390

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$4.390

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Mouser Electronics

USA . 190 parts In-Stock

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$6.330

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$4.490

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$4.290

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190

$6.330

$4.490

$4.290

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DigiKey

USA . 152 parts In-Stock

1+ parts

$7.700

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$5.267

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$4.938

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152

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$4.938

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Flip Electronics (Authorized)

USA . 8,413 parts In-Stock

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Future Electronics

Canada . 445 parts In-Stock

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$4.490

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$4.330

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$4.280

445

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Verical

USA . 413 parts In-Stock

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$3.878

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413

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$3.878

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Distributors (In-Stock)

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Digiode

USA . 451 parts In-Stock

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$3.280

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451

$3.280

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Nova Conductors

Japan . 10 parts In-Stock

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$3.720

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Flip Electronics

USA . 7,133 parts In-Stock

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Vyrian

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Prism Electronics

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Semi Source

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LIBRA Elektronik GmbH

Germany . 83 parts In-Stock

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Speed Components Ltd

Israel . 83 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 53 parts In-Stock

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Dan-Mar Components

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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Bristol Electronics

USA . 17 parts In-Stock

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Sea View Technologies

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LWI Electronics Inc

India . 7 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,817 parts In-Stock

1+ parts

$2.940

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$2.940

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Corphita

USA . 165 parts In-Stock

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$3.108

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Continental Prestige Electronics

USA . 2,575 parts In-Stock

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$3.720

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$3.646

2,575

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$3.646

Argo Parts USA

USA . 1,357 parts In-Stock

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$3.720

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Netroflash

USA . 100 parts In-Stock

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$3.720

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$3.646

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100

$3.720

$3.646

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Component Stockers USA

USA . 7,601 parts In-Stock

1+ parts

$4.220

100+ parts

$3.970

1k+ parts

$3.580

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7,601

$4.220

$3.970

$3.580

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Modulus Dynamics

Lithuania . 1,079 parts In-Stock

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$9.644

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$9.258

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$8.872

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Lixinc

USA . 15,286 parts In-Stock

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RC Electronics

USA . 7,743 parts In-Stock

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$4.820

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$4.550

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$4.460

7,743

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$4.460

A-Z Elektronik GmbH

Germany . 5,936 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,223 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,957 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Kepictronics

USA . 3,740 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 1,430 parts In-Stock

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Metaverse IC Inc.

Canada . 1,295 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 7 parts In-Stock

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Overview

Unlock the power of precise timing with the CY2309SXC-1H clock driver from Infineon Technologies. Designed with top-quality materials and cutting-edge technology, this small outline package offers 3-state output characteristics and a fast propagation delay of 8.7 ns. Perfect for a wide range of applications, this clock driver provides customers with reliable performance and unmatched precision. Say goodbye to timing issues and hello to seamless synchronization with the CY2309SXC-1H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a durable and lightweight construction, ideal for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easier installation and integration into compact electronic designs.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for different use cases.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact footprint while still providing ample space for the necessary components.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V nominal supply voltage ensures compatibility with common power sources, making it easy to incorporate into existing systems.

Power Supplies (V): 3.3V

Having a consistent 3.3V power supply simplifies system design and reduces the need for additional voltage regulation.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connectivity options and can support complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space in circuit board layouts and allows for high-density mounting.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this product can drive multiple components or devices without the risk of overload.

Propagation Delay (tpd): 8.7 ns

The low propagation delay of 8.7ns ensures fast and efficient signal transmission, essential for high-speed applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for reliable performance in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers CY2309SXC-1H attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

2309

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.893 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.8985 mm

Minimum fmax:

133.33 MHz

Trade Compliance

CY2309SXC-1H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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