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CY2305SXI-1H

Infineon Technologies

CY2305SXI-1H by Infineon Technologies

CY2305SXI-1H clock driver by Infineon operates at 3.3V, with 8 true outputs and a max frequency of 133.33MHz. It has a propagation delay of 8.7ns, suitable for industrial applications requiring precise timing control in compact designs. The small outline package with gull wing terminals makes it ideal for surface mount PCB layouts in harsh environments.

Median Price

$2.160

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,645 parts In-Stock

1+ parts

$2.150

100+ parts

$2.070

1k+ parts

$1.990

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1,645

$2.150

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$1.990

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Mouser Electronics

USA . 1,169 parts In-Stock

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$3.230

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$2.350

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$2.270

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$2.260

1,169

$3.230

$2.350

$2.270

$2.260

Chip1Stop

Japan . 29 parts In-Stock

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$8.200

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Element14

Singapore . 509 parts In-Stock

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$241.400

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$178.200

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$127.300

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$121.400

509

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$121.400

Flip Electronics (Authorized)

USA . 23,940 parts In-Stock

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DigiKey

USA . 23,690 parts In-Stock

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Verical

USA . 23,690 parts In-Stock

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$1.834

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Rochester

USA . 6,822 parts In-Stock

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$2.170

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Arrow

USA . 694 parts In-Stock

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Freelance Electronics

USA . 9 parts In-Stock

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$1.367

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Digiode

USA . 374 parts In-Stock

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TEDSS.com

USA . 89 parts In-Stock

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USA . 23,690 parts In-Stock

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DigiKey Marketplace

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Vyrian

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NexGen Digital

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Dark Horse Electronics

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Bristol Electronics

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Speed Components Ltd

Israel . 780 parts In-Stock

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ComSIT Distribution GmbH

Germany . 746 parts In-Stock

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ComSIT USA

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Sensible Micro Corp

USA . 620 parts In-Stock

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Inventory MP

USA . 510 parts In-Stock

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510

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TME

Poland . 454 parts In-Stock

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$3.971

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$3.970

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LIBRA Elektronik GmbH

Germany . 342 parts In-Stock

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Prism Electronics

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Sogenti Electronics

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EMSNET

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North Shore Components

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PC Components Company LLC

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Japan . 50 parts In-Stock

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Semi Source

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Mil-Aero Solutions, Inc.

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Cyclops Electronics Ltd

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Distributors (Availability)

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Andel Nordic

Denmark . 1,856 parts In-Stock

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$1.506

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$1.445

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$1.445

1,856

$1.506

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$1.445

$1.445

Semicontronic

India . 5,498 parts In-Stock

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$1.710

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$1.667

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$1.659

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5,498

$1.710

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Ampacity Inc.

Singapore . 3,677 parts In-Stock

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$1.730

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3,677

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Corphita

USA . 283 parts In-Stock

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$1.832

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283

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Component Stockers USA

USA . 9,093 parts In-Stock

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$2.230

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$2.320

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$2.160

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9,093

$2.230

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Continental Prestige Electronics

USA . 2,397 parts In-Stock

1+ parts

$3.140

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$2.340

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$1.690

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2,397

$3.140

$2.340

$1.690

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Modulus Dynamics

Lithuania . 102 parts In-Stock

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$22.337

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$21.444

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$20.550

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102

$22.337

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$20.550

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Aztec Data Supply Inc.

USA . 1,538 parts In-Stock

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$27.671

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Corohmni

South Africa . 1,221 parts In-Stock

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$27.693

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RC Electronics

USA . 17,597 parts In-Stock

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$2.190

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$2.070

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$2.020

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Lixinc

USA . 10,849 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,477 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

USA . 4,281 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,651 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,882 parts In-Stock

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Argo Parts USA

USA . 1,634 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Metaverse IC Inc.

Canada . 233 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 103 parts In-Stock

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Overview

Unlock the power of precision timing with the CY2305SXI-1H clock driver by Infineon Technologies. Designed with quality and reliability in mind, this product offers a wide range of applications in the Clock Drivers & Buffers category. With its compact design and advanced features, the CY2305SXI-1H provides customers with unmatched value, benefits, and advantages. Whether you need precise synchronization or efficient signal buffering, this product is the perfect solution for all your timing needs. Elevate your projects with the superior performance of the CY2305SXI-1H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and allows for a lightweight design, making it ideal for various applications.

Surface Mount: YES

This feature enables easy and secure installation on a PCB, saving space and simplifying assembly processes.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of systems and signals, making it versatile and easy to integrate.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, allowing for efficient use of board space and easy integration into designs.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is widely used in many applications, offering a stable power source for consistent performance.

Power Supplies (V): 3.3

The power supply of 3.3V ensures compatibility with common voltage levels, making it suitable for a variety of electronic devices.

No. of Terminals: 8

With 8 terminals, this product offers sufficient connectivity options for multiple inputs and outputs, increasing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall footprint, making it well-suited for compact designs and space-constrained applications.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this clock driver/buffer can deliver robust and reliable performance for demanding applications.

Propagation Delay (tpd): 8.7 ns

The low propagation delay of 8.7ns ensures fast signal transmission, enhancing the efficiency and speed of the system.

Technical Specifications

Clock Drivers & Buffers CY2305SXI-1H attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.8985 mm

Minimum fmax:

133.33 MHz

Trade Compliance

CY2305SXI-1H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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