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CY2309NZSXC-1H

Infineon Technologies

CY2309NZSXC-1H by Infineon Technologies

Infineon Technologies' CY2309NZSXC-1H clock driver has a propagation delay of 9.2 ns at 3.3V, suitable for applications requiring precise timing control up to 133.33 MHz. With a small outline package and dual terminal position, it offers high-speed performance in commercial temperature grades.

Median Price

$13.787

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

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Future Electronics

Canada . 240 parts In-Stock

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$11.320

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$10.940

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Arrow

USA . 1 parts In-Stock

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Mouser Electronics

USA . 960 parts In-Stock

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Farnell

UK . 947 parts In-Stock

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Newark

USA . 947 parts In-Stock

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$19.380

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Chip1Stop

Japan . 1 parts In-Stock

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Flip Electronics (Authorized)

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Rochester

USA . 4,568 parts In-Stock

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$9.290

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Verical

USA . 2,349 parts In-Stock

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DigiKey

USA . 2,203 parts In-Stock

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Digiode

USA . 239 parts In-Stock

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Bristol Electronics

USA . 48 parts In-Stock

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$13.500

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$8.438

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Flip Electronics

USA . 4,123 parts In-Stock

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Vyrian

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Pegasus Components GmbH

Germany . 1,008 parts In-Stock

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J2 Sourcing AB

Sweden . 281 parts In-Stock

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Electronics Depot

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Dark Horse Electronics

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R&J Components

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Semi Source

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LIBRA Elektronik GmbH

Germany . 53 parts In-Stock

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Nova Conductors

Japan . 48 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

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PC Components Company LLC

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Inventory MP

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Manoshevitz Elec. Sales

Israel . 35 parts In-Stock

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SPM Sales

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Standard Data Resources

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Flex Direct, LLC

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Sunrise Surplus Inc.

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Prism Electronics

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Distributors (Availability)

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Andel Nordic

Denmark . 2,366 parts In-Stock

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$7.242

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$6.952

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$6.952

2,366

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$6.952

Ampacity Inc.

Singapore . 1,427 parts In-Stock

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$8.420

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Corphita

USA . 646 parts In-Stock

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$9.882

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Modulus Dynamics

Lithuania . 3,685 parts In-Stock

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$14.143

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$13.577

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$13.012

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Semicontronic

India . 1,534 parts In-Stock

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$18.320

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$17.862

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$17.770

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Corohmni

South Africa . 352 parts In-Stock

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$30.903

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Aztec Data Supply Inc.

USA . 2,471 parts In-Stock

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$31.792

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 4,868 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,245 parts In-Stock

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RC Electronics

USA . 2,702 parts In-Stock

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$12.260

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$12.010

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$12.010

QUARKTWIN TECHNOLOGY LTD

USA . 2,439 parts In-Stock

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Argo Parts USA

USA . 837 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Elevate your electronics with the CY2309NZSXC-1H by Infineon Technologies. As a leader in clock drivers & buffers, Infineon offers top-quality products that deliver outstanding performance. This small outline package boasts a nominal supply voltage of 3.3V and a maximum I (ol) of 8 Amp, making it ideal for a wide range of applications. With a propagation delay of 9.2 ns and dual terminal position, this product ensures reliable and efficient operation. Experience the benefits of Infineon's cutting-edge technology with the CY2309NZSXC-1H - elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for long-term use.

Propagation Delay At Nominal Supply: 9.2 ns

With a quick propagation delay of 9.2 ns, this clock driver ensures efficient operation and timely signal transmission.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various devices, making this clock driver versatile and widely applicable.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, saving valuable space on PCBs and improving overall system efficiency.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3V, this clock driver is energy-efficient and suitable for low-power applications.

Power Supplies: 3.3 V

The availability of multiple power supply options at 3.3V ensures flexibility and compatibility with different circuit configurations.

No. of Terminals: 16

With 16 terminals, this clock driver provides ample connectivity options for interfacing with other components, enhancing overall system functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a sleek and space-saving design, perfect for compact electronic devices and applications.

Maximum I (ol): 8 Amp

The maximum output current of 8 Amp ensures reliable performance and the ability to drive multiple loads without overheating.

Propagation Delay (tpd): 9.2 ns

The low propagation delay of 9.2 ns ensures fast signal transmission, reducing latency and improving system response time.

Technical Specifications

Clock Drivers & Buffers CY2309NZSXC-1H attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

2309

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.893 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

9

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

9.2 ns

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.8985 mm

Minimum fmax:

133.33 MHz

Trade Compliance

CY2309NZSXC-1H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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