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MC100EP210SFATWG

Onsemi

MC100EP210SFATWG by Onsemi

MC100EP210SFATWG clock driver by Onsemi features 0.675ns propagation delay, 2.5V nominal voltage, and 32 terminals in a square package. Ideal for industrial applications requiring differential input conditioning and low profile flatpack style with gull wing terminals.

Median Price

$11.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,170 parts In-Stock

1+ parts

$11.850

100+ parts

$11.610

1k+ parts

$11.380

10k+ parts

-

19,170

$11.850

$11.610

$11.380

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Distributors (In-Stock)

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Vyrian

USA . 3,845 parts In-Stock

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3,845

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Digiode

USA . 376 parts In-Stock

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376

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 839 parts In-Stock

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$7.719

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-

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839

$7.719

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Aztec Data Supply Inc.

USA . 4,459 parts In-Stock

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$10.562

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4,459

$10.562

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Semicontronic

India . 324 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

324

$34.000

$33.150

$32.980

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$49.000

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254

$49.000

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SupplyDigital Components

Austria . 4,477 parts In-Stock

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4,477

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TANS Electronics

Latvia . 4,354 parts In-Stock

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Kulean Microsystems

USA . 4,299 parts In-Stock

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Continental Prestige Electronics

USA . 3,212 parts In-Stock

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Argo Parts USA

USA . 2,803 parts In-Stock

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Corphita

USA . 2,466 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 635 parts In-Stock

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635

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Microchip USA

USA . 446 parts In-Stock

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446

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Corohmni

South Africa . 356 parts In-Stock

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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178

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Overview

Enhance your clock driver and buffer applications with the MC100EP210SFATWG by Onsemi. This high-quality product from a trusted manufacturer offers unparalleled performance, reliability, and precision in clock signal distribution. With a fast propagation delay and differential input conditioning, this device ensures seamless synchronization in your circuit design. The square package shape and low profile style make integration easy, while the industrial temperature grade guarantees durability in challenging environments. Elevate your projects with the cutting-edge technology of the MC100EP210SFATWG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 0.675 ns

With a low propagation delay, this clock driver offers fast and efficient signal processing.

Surface Mount: YES

The surface mount capability makes installation easier and allows for efficient use of PCB space.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in minimizing signal noise and interference, ensuring accurate signal transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a commonly used supply voltage of 2.5V makes this product compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock driver can withstand harsh environmental conditions and maintain performance.

Technology: ECL

Using ECL technology ensures high-speed operations and low power consumption, making this product efficient and reliable.

Technical Specifications

Clock Drivers & Buffers MC100EP210SFATWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

.675 ns

Propagation Delay (tpd):

.65 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

MC100EP210SFATWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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