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MC100EL15DG

Onsemi

MC100EL15DG by Onsemi

MC100EL15DG clock driver by Onsemi features 0.75ns propagation delay, 5V nominal voltage, and -40 to 85°C operating temperature range. Ideal for differential mux input conditioning in industrial applications.

Median Price

$4.900

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 34 parts In-Stock

1+ parts

$3.446

100+ parts

$2.578

1k+ parts

$2.395

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34

$3.446

$2.578

$2.395

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DigiKey

USA . 1,291 parts In-Stock

1+ parts

$4.900

100+ parts

$3.269

1k+ parts

$2.862

10k+ parts

$2.711

1,291

$4.900

$3.269

$2.862

$2.711

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$4.900

100+ parts

$3.040

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$2.860

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$2.650

5

$4.900

$3.040

$2.860

$2.650

Chip1Stop

Japan . 154 parts In-Stock

1+ parts

$4.946

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$2.908

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154

$4.946

$2.908

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Verical

USA . 34 parts In-Stock

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-

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$2.578

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$2.395

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34

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$2.578

$2.395

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Distributors (In-Stock)

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Digiode

USA . 1,913 parts In-Stock

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$2.275

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$2.275

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Flip Electronics

USA . 4,560 parts In-Stock

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4,560

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Bristol Electronics

USA . 856 parts In-Stock

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856

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 312 parts In-Stock

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312

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Ashlea Components Ltd

UK . 22 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 295 parts In-Stock

1+ parts

$2.040

100+ parts

$1.989

1k+ parts

$1.979

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295

$2.040

$1.989

$1.979

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Corphita

USA . 1,715 parts In-Stock

1+ parts

$2.156

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1,715

$2.156

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Corohmni

South Africa . 347 parts In-Stock

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$2.395

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347

$2.395

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Ampacity Inc.

Singapore . 134 parts In-Stock

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$4.430

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134

$4.430

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Microchip USA

USA . 2,279 parts In-Stock

1+ parts

$15.740

100+ parts

$15.510

1k+ parts

$15.400

10k+ parts

$15.290

2,279

$15.740

$15.510

$15.400

$15.290

Aztec Data Supply Inc.

USA . 3,618 parts In-Stock

1+ parts

$23.970

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3,618

$23.970

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SupplyDigital Components

Austria . 8,050 parts In-Stock

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Problanco Electronics

Mexico . 7,877 parts In-Stock

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Kulean Microsystems

USA . 7,492 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,427 parts In-Stock

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Continental Prestige Electronics

USA . 5,655 parts In-Stock

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TANS Electronics

Latvia . 3,959 parts In-Stock

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Argo Parts USA

USA . 1,127 parts In-Stock

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 94 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

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Overview

Enhance your electronic designs with the MC100EL15DG clock driver & buffer from Onsemi. With a reputation for high-quality products, Onsemi delivers reliability and performance in every component. This versatile device is perfect for applications requiring precision timing, ensuring seamless operation in various systems. Experience the value of fast propagation delays, differential input conditioning, and a wide temperature range. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the MC100EL15DG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 0.75 ns

Low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this clock driver compatible with common power sources.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in extreme environments, increasing the product's versatility.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides reliable electrical connections and solderability, ensuring robust performance.

Width: 3.9 mm

Compact width allows for space-saving design and integration into tight layouts or crowded PCBs.

Maximum Power Supply Current (ICC): 38 mA

Low power supply current consumption helps in minimizing power dissipation and improving overall energy efficiency.

Technical Specifications

Clock Drivers & Buffers MC100EL15DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0 WITH VEE = -4.2 TO -5.7V SUPPLY

Family:

100EL

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

.75 ns

Propagation Delay (tpd):

.72 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EL15DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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