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MC100LVEL11DTG

Onsemi

MC100LVEL11DTG by Onsemi

MC100LVEL11DTG clock driver by Onsemi features 0.435ns propagation delay, 3.3V nominal voltage, and 1000MHz min fmax. Ideal for industrial applications requiring differential input conditioning and high-speed signal transmission in a compact thin profile package.

Median Price

$2.681

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 84 parts In-Stock

1+ parts

$6.430

100+ parts

$3.740

1k+ parts

$2.740

10k+ parts

$2.600

84

$6.430

$3.740

$2.740

$2.600

Rochester

USA . 7,390 parts In-Stock

1+ parts

-

100+ parts

$2.420

1k+ parts

$2.170

10k+ parts

$2.040

7,390

-

$2.420

$2.170

$2.040

DigiKey

USA . 7,390 parts In-Stock

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$2.650

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7,390

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$2.650

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Verical

USA . 4,964 parts In-Stock

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$2.712

10k+ parts

$2.550

4,964

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$2.712

$2.550

Distributors (In-Stock)

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Digiode

USA . 1,582 parts In-Stock

1+ parts

$2.565

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1,582

$2.565

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Flip Electronics

USA . 9,300 parts In-Stock

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9,300

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 2,995 parts In-Stock

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2,995

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R&J Components

USA . 363 parts In-Stock

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363

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Pegasus Components GmbH

Germany . 131 parts In-Stock

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Inventory MP

USA . 66 parts In-Stock

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66

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Bristol Electronics

USA . 66 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,406 parts In-Stock

1+ parts

$2.290

100+ parts

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3,406

$2.290

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Corphita

USA . 863 parts In-Stock

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$2.430

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863

$2.430

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Corohmni

South Africa . 370 parts In-Stock

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$2.700

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370

$2.700

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Semicontronic

India . 3,333 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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3,333

$5.000

$4.875

$4.850

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Microchip USA

USA . 2,616 parts In-Stock

1+ parts

$15.260

100+ parts

$15.040

1k+ parts

$14.930

10k+ parts

$14.820

2,616

$15.260

$15.040

$14.930

$14.820

Aztec Data Supply Inc.

USA . 2,037 parts In-Stock

1+ parts

$32.257

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2,037

$32.257

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Lixinc

USA . 8,287 parts In-Stock

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SupplyDigital Components

Austria . 3,930 parts In-Stock

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Problanco Electronics

Mexico . 3,883 parts In-Stock

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Continental Prestige Electronics

USA . 3,722 parts In-Stock

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TANS Electronics

Latvia . 2,688 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Kulean Microsystems

USA . 805 parts In-Stock

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UHIMA Technologies

Türkiye . 668 parts In-Stock

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668

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Argo Parts USA

USA . 349 parts In-Stock

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349

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Perfect Parts

USA . 325 parts In-Stock

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325

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Eastek

USA . 100 parts In-Stock

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$3.648

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Overview

Discover the innovative MC100LVEL11DTG clock driver by Onsemi, a leading manufacturer known for top-quality products. Ideal for clock distribution in various applications, this device offers low propagation delay and differential input conditioning for optimal performance. With its small outline package and industrial-grade temperature range, this clock driver ensures reliable operation in any environment. Experience the benefits of precise timing and efficient signal distribution with the MC100LVEL11DTG, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 0.435 ns

Low propagation delay ensures efficient signal transmission and synchronization in clock distribution systems.

Surface Mount: YES

Surface mount technology enables easy integration onto PCBs, saving space and simplifying assembly processes.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, crucial for clock distribution circuits.

No. of True Outputs: 2

Having multiple true outputs allows for flexibility in connecting to different components or subsystems in a clock distribution network.

Technical Specifications

Clock Drivers & Buffers MC100LVEL11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.435 ns

Propagation Delay (tpd):

.405 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

1000 MHz

Trade Compliance

MC100LVEL11DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-660-7195, 5962016607195

NIIN

016607195

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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