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PI6C4931502-04LIEX

Diodes Incorporated

PI6C4931502-04LIEX by Diodes Incorporated

PI6C4931502-04LIEX clock driver by Diodes Inc. operates at 250 MHz with 4 true outputs, suitable for industrial applications. It features a differential mux input conditioning and a supply voltage range of 2.375V to 2.625V, making it ideal for small outline, thin profile packages in surface-mount designs. With a temperature range of -40°C to 85°C, this device is designed for high-performance clock distribution systems.

Median Price

$2.250

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 536 parts In-Stock

1+ parts

$2.250

100+ parts

$1.370

1k+ parts

$1.210

10k+ parts

$1.160

536

$2.250

$1.370

$1.210

$1.160

DigiKey

USA . 310 parts In-Stock

1+ parts

$2.250

100+ parts

$1.362

1k+ parts

$1.201

10k+ parts

$1.125

310

$2.250

$1.362

$1.201

$1.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 723 parts In-Stock

1+ parts

-

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723

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 2,618 parts In-Stock

1+ parts

$2.470

100+ parts

$1.780

1k+ parts

$1.220

10k+ parts

-

2,618

$2.470

$1.780

$1.220

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Microchip USA

USA . 1,923 parts In-Stock

1+ parts

$7.371

100+ parts

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1,923

$7.371

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Corohmni

South Africa . 642 parts In-Stock

1+ parts

$19.364

100+ parts

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642

$19.364

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Aztec Data Supply Inc.

USA . 333 parts In-Stock

1+ parts

$29.415

100+ parts

-

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333

$29.415

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Continental Prestige Electronics

USA . 6,641 parts In-Stock

1+ parts

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6,641

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Argo Parts USA

USA . 2,833 parts In-Stock

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2,833

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your clock driver and buffer needs with the PI6C4931502-04LIEX by Diodes Incorporated. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability in clock distribution applications. From its small outline package design to its industrial-grade temperature tolerance, this clock driver ensures optimal functionality and efficiency. Experience seamless differential MUX input conditioning and four true outputs, delivering a maximum frequency of 250 MHz. Trust in Diodes Incorporated for cutting-edge solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring lasting performance.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a common voltage level, making it compatible with a wide range of systems and components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments and applications.

Minimum Operating Temperature: -40 °C

Provides reliable operation even in extreme cold conditions, ensuring consistent performance.

Width: 4.4 mm

Compact size allows for easy integration into space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, enhancing reliability and performance.

Minimum fmax: 250 MHz

Supports high-frequency operation, making it suitable for demanding clock synchronization applications.

Technical Specifications

Clock Drivers & Buffers PI6C4931502-04LIEX attributes and parameters. Explore more Clock Drivers & Buffers devices from Diodes Incorporated

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

6C

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.6

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

250 MHz

Trade Compliance

PI6C4931502-04LIEX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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