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NB6L16DG

Onsemi

NB6L16DG by Onsemi

NB6L16DG clock driver by Onsemi is a differential input buffer with 8 terminals. It operates on a supply voltage range of 2.375V to 3.465V and has a propagation delay of 0.18ns. Ideal for industrial applications requiring precise clock signal distribution in compact spaces due to its small outline package style.

Median Price

$7.510

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 10,848 parts In-Stock

1+ parts

-

100+ parts

$7.510

1k+ parts

-

10k+ parts

-

10,848

-

$7.510

-

-

Rochester

USA . 10,448 parts In-Stock

1+ parts

-

100+ parts

$6.180

1k+ parts

$5.530

10k+ parts

$5.210

10,448

-

$6.180

$5.530

$5.210

Flip Electronics (Authorized)

USA . 7,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,729

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Verical

USA . 5,415 parts In-Stock

1+ parts

-

100+ parts

$8.113

1k+ parts

$7.263

10k+ parts

$6.825

5,415

-

$8.113

$7.263

$6.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,183 parts In-Stock

1+ parts

$6.859

100+ parts

-

1k+ parts

-

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-

2,183

$6.859

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$6.864

100+ parts

-

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150

$6.864

-

-

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DigiKey Marketplace

USA . 11,038 parts In-Stock

1+ parts

-

100+ parts

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11,038

-

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Vyrian

USA . 9,817 parts In-Stock

1+ parts

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9,817

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Flip Electronics

USA . 7,429 parts In-Stock

1+ parts

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7,429

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-

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ACDS - Activité Composants Distribution Service

France . 86 parts In-Stock

1+ parts

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86

-

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Elcom Components

USA . 15 parts In-Stock

1+ parts

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15

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Speed Components Ltd

Israel . 8 parts In-Stock

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8

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SPM Sales

USA . 2 parts In-Stock

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2

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,029 parts In-Stock

1+ parts

$6.140

100+ parts

-

1k+ parts

-

10k+ parts

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10,029

$6.140

-

-

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Semicontronic

India . 9,679 parts In-Stock

1+ parts

$6.140

100+ parts

$5.986

1k+ parts

$5.956

10k+ parts

-

9,679

$6.140

$5.986

$5.956

-

Corphita

USA . 2,249 parts In-Stock

1+ parts

$6.498

100+ parts

-

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10k+ parts

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2,249

$6.498

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.864

100+ parts

$6.727

1k+ parts

-

10k+ parts

-

1,000

$6.864

$6.727

-

-

Corohmni

South Africa . 335 parts In-Stock

1+ parts

$7.220

100+ parts

-

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335

$7.220

-

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Aztec Data Supply Inc.

USA . 312 parts In-Stock

1+ parts

$12.177

100+ parts

-

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312

$12.177

-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$39.397

100+ parts

$35.851

1k+ parts

$32.306

10k+ parts

-

500

$39.397

$35.851

$32.306

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Continental Prestige Electronics

USA . 11,038 parts In-Stock

1+ parts

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11,038

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SupplyDigital Components

Austria . 5,500 parts In-Stock

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5,500

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TANS Electronics

Latvia . 5,315 parts In-Stock

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5,315

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 2,680 parts In-Stock

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2,680

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Problanco Electronics

Mexico . 2,052 parts In-Stock

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2,052

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Perfect Parts

USA . 1,026 parts In-Stock

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1,026

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Microchip USA

USA . 431 parts In-Stock

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431

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Kulean Microsystems

USA . 380 parts In-Stock

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380

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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191

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Kepictronics

USA . 175 parts In-Stock

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175

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Cyclops Electronics Ltd (Excess)

UK . 86 parts In-Stock

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86

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Overview

Enhance your clock drivers and buffers with the NB6L16DG from Onsemi, a reliable and high-quality manufacturer. This versatile product offers differential input conditioning in a small outline package style, making it perfect for a wide range of industrial applications. With a nominal supply voltage of 2.5V and a propagation delay of just 0.18 ns, the NB6L16DG provides fast and efficient performance. Trust Onsemi to deliver top-notch technology that meets your needs and exceeds your expectations. Upgrade your systems today with the NB6L16DG and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

The differential input conditioning ensures accurate and reliable signal transmission, making this product suitable for high-performance systems.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, optimizing space efficiency in electronic devices.

Nominal Supply Voltage / Vsup (V): 2.5

With a nominal supply voltage of 2.5V, this product is compatible with a wide range of systems and power sources.

No. of Terminals: 8

The eight terminals provide sufficient connectivity options, allowing for versatile integration into different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves on board space, making it a practical choice for compact electronic designs.

Propagation Delay (tpd): 0.18 ns

The low propagation delay ensures fast and efficient signal transmission, essential for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand challenging thermal conditions, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C to 85°C ensures reliable performance in both extreme cold and hot conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing the product's longevity.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, accommodating various installation requirements.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75mm makes this product suitable for applications with tight spacing constraints.

Width: 3.9 mm

The compact width of 3.9mm enables the product to fit seamlessly into small circuit layouts, maximizing board real estate.

Minimum Supply Voltage (Vsup): 2.375 V

With a minimum supply voltage of 2.375V, this product can operate reliably even at lower power levels.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, contributing to product reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and secure soldering, ensuring the product's durability under thermal stress.

Length: 4.9 mm

The length of 4.9mm provides a well-balanced form factor, making the product suitable for various electronic applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade use, this product can withstand harsh environmental conditions and demanding performance requirements.

Technology: ECL

Utilizing ECL technology offers high-speed operation and low power consumption, making this product energy-efficient and suitable for high-performance systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical attachment and ease of handling during installation, ensuring a reliable connection.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise placement on a circuit board, contributing to ease of assembly and alignment.

Maximum Same Edge Skew (tskwd): 0.06 ns

The minimal same edge skew of 0.06ns ensures accurate signal synchronization and timing, vital for data integrity in communication systems.

Maximum Supply Voltage (Vsup): 3.465 V

With a maximum supply voltage of 3.465V, this product offers flexibility in power requirements and compatibility with a variety of voltage sources.

Technical Specifications

Clock Drivers & Buffers NB6L16DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NB6L16DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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