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NB6L14MNR2G

Onsemi

NB6L14MNR2G by Onsemi

NB6L14MNR2G clock driver by Onsemi features differential input conditioning, 0.35 ns propagation delay, and 4 true outputs. It is a surface-mount chip carrier suitable for industrial applications requiring precise timing at temperatures ranging from -40 to 85°C.

Median Price

$12.580

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 11,826 parts In-Stock

1+ parts

$11.420

100+ parts

$11.190

1k+ parts

$10.960

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11,826

$11.420

$11.190

$10.960

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DigiKey

USA . 2,835 parts In-Stock

1+ parts

$12.580

100+ parts

$8.479

1k+ parts

$7.740

10k+ parts

$7.524

2,835

$12.580

$8.479

$7.740

$7.524

Mouser Electronics

USA . 878 parts In-Stock

1+ parts

$12.580

100+ parts

$8.480

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$7.740

10k+ parts

$7.430

878

$12.580

$8.480

$7.740

$7.430

Distributors (In-Stock)

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Nova Conductors

Japan . 89 parts In-Stock

1+ parts

$8.230

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89

$8.230

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Digiode

USA . 617 parts In-Stock

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$10.849

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617

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Chip Stock

USA . 8,510 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 4,874 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,207 parts In-Stock

1+ parts

$6.030

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5,207

$6.030

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Corohmni

South Africa . 303 parts In-Stock

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$7.341

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$7.341

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Continental Prestige Electronics

USA . 3,526 parts In-Stock

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$8.230

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$8.065

3,526

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$8.065

Corphita

USA . 151 parts In-Stock

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$10.278

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Microchip USA

USA . 4,747 parts In-Stock

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$21.570

100+ parts

$21.260

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$21.110

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$20.960

4,747

$21.570

$21.260

$21.110

$20.960

Perfect Parts

USA . 23,520 parts In-Stock

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Lixinc

USA . 17,152 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

USA . 7,624 parts In-Stock

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SupplyDigital Components

Austria . 6,658 parts In-Stock

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iodParts Technologies Inc.

India . 5,790 parts In-Stock

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Problanco Electronics

Mexico . 5,250 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,799 parts In-Stock

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RC Electronics

USA . 3,730 parts In-Stock

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Argo Parts USA

USA . 3,612 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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UHIMA Technologies

Türkiye . 283 parts In-Stock

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TANS Electronics

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Kepictronics

USA . 150 parts In-Stock

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Overview

Enhance your electronics projects with the NB6L14MNR2G by Onsemi, a top-quality clock driver and buffer that delivers precision and reliability. Manufactured by Onsemi, a trusted name in the industry, this product boasts a square package shape and differential input conditioning for seamless integration. Ideal for a wide range of applications, this chip carrier features a very thin profile and quad terminal position for easy installation. With a nominal supply voltage of 2.5V and maximum operating temperature of 85°C, the NB6L14MNR2G offers exceptional value, performance, and efficiency to meet all your project needs.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount design makes it easy to integrate into PCBs and saves space on the board.

Input Conditioning: DIFFERENTIAL

Differential input conditioning improves noise immunity and signal integrity in the system.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with various systems and components.

Propagation Delay (tpd): 0.35 ns

Low propagation delay of 0.35 ns results in high-speed signal processing and minimized latency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand demanding industrial environments.

Width: 3 mm

Compact width of 3 mm allows for efficient board layout and space-saving integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh temperature conditions.

No. of True Outputs: 4

Having 4 true outputs allows for versatile signal distribution and processing capabilities.

Technical Specifications

Clock Drivers & Buffers NB6L14MNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES WITH 3.3V SUPPLY

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L14MNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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