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NB6L11MMNR2G

Onsemi

NB6L11MMNR2G by Onsemi

NB6L11MMNR2G clock driver by Onsemi features a propagation delay of 0.325 ns, operates at a nominal voltage of 2.5 V, and has differential input conditioning. This chip carrier with a very thin profile is suitable for industrial applications requiring precise timing synchronization in electronic systems.

Median Price

$38.445

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,354 parts In-Stock

1+ parts

$18.590

100+ parts

$12.817

1k+ parts

$12.023

10k+ parts

$11.473

1,354

$18.590

$12.817

$12.023

$11.473

Chip1Stop

Japan . 3,080 parts In-Stock

1+ parts

$58.300

100+ parts

$27.600

1k+ parts

$17.200

10k+ parts

-

3,080

$58.300

$27.600

$17.200

-

Distributors (In-Stock)

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Digiode

USA . 1,153 parts In-Stock

1+ parts

$19.418

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-

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1,153

$19.418

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Vyrian

USA . 1,810 parts In-Stock

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$20.440

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1,810

$20.440

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Flip Electronics

USA . 3,100 parts In-Stock

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3,100

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LIBRA Elektronik GmbH

Germany . 1,344 parts In-Stock

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1,344

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Distributors (Availability)

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Component Stockers USA

USA . 3,692 parts In-Stock

1+ parts

$17.770

100+ parts

$13.790

1k+ parts

$12.270

10k+ parts

-

3,692

$17.770

$13.790

$12.270

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Corphita

USA . 567 parts In-Stock

1+ parts

$18.396

100+ parts

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567

$18.396

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Corohmni

South Africa . 54 parts In-Stock

1+ parts

$20.440

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54

$20.440

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Microchip USA

USA . 4,870 parts In-Stock

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$33.113

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4,870

$33.113

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Perfect Parts

USA . 20,765 parts In-Stock

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20,765

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TANS Electronics

Latvia . 7,248 parts In-Stock

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Kulean Microsystems

USA . 5,288 parts In-Stock

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5,288

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SupplyDigital Components

Austria . 4,981 parts In-Stock

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Authorized Procurement Solutions

USA . 3,180 parts In-Stock

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Problanco Electronics

Mexico . 3,086 parts In-Stock

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GreenTree Electronics

Israel . 3,080 parts In-Stock

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3,080

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UHIMA Technologies

Türkiye . 452 parts In-Stock

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452

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Kepictronics

USA . 230 parts In-Stock

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Overview

Enhance your clock driver & buffer performance with the NB6L11MMNR2G by Onsemi! Designed with precision and reliability in mind, this product offers exceptional value to customers looking for top-notch quality. Ideal for a variety of applications, this chip carrier features a very thin profile and differential input conditioning, making it a versatile solution for your electronic needs. Trust Onsemi's reputation for excellence and unlock the potential of your projects with the NB6L11MMNR2G.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.325 ns

This low propagation delay ensures fast operation and reliable performance.

Surface Mount: YES

Being surface mountable saves space and makes installation easier.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in noise reduction and signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard 2.5V supply voltage for compatibility with various systems.

Package Shape: SQUARE

Square package shape allows for efficient layout and space utilization on the PCB.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Technical Specifications

Clock Drivers & Buffers NB6L11MMNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.325 ns

Propagation Delay (tpd):

.325 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L11MMNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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