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NB6L56MNG

Onsemi

NB6L56MNG by Onsemi

NB6L56MNG clock driver by Onsemi features a low propagation delay of 0.36 ns and operates at a nominal voltage of 2.5V, suitable for industrial applications. With differential mux input conditioning and 2 true outputs, it offers high-speed performance up to 2500 MHz in a compact square package style with surface mount capability.

Median Price

$5.744

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5,278 parts In-Stock

1+ parts

-

100+ parts

$5.810

1k+ parts

-

10k+ parts

-

5,278

-

$5.810

-

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Rochester

USA . 5,226 parts In-Stock

1+ parts

-

100+ parts

$4.370

1k+ parts

$3.910

10k+ parts

$3.680

5,226

-

$4.370

$3.910

$3.680

DigiKey

USA . 5,226 parts In-Stock

1+ parts

-

100+ parts

$5.750

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-

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5,226

-

$5.750

-

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Verical

USA . 5,190 parts In-Stock

1+ parts

-

100+ parts

$5.737

1k+ parts

$5.138

10k+ parts

$4.825

5,190

-

$5.737

$5.138

$4.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 770 parts In-Stock

1+ parts

$4.845

100+ parts

-

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770

$4.845

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Vyrian

USA . 10,338 parts In-Stock

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10,338

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Flip Electronics

USA . 8,066 parts In-Stock

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8,066

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Euro-Tech

UK . 74 parts In-Stock

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74

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Nova Conductors

Japan . 69 parts In-Stock

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69

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Prism Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,783 parts In-Stock

1+ parts

$4.330

100+ parts

-

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4,783

$4.330

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Corphita

USA . 977 parts In-Stock

1+ parts

$4.590

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-

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977

$4.590

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Corohmni

South Africa . 140 parts In-Stock

1+ parts

$5.100

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140

$5.100

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Microchip USA

USA . 429 parts In-Stock

1+ parts

$24.724

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429

$24.724

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Aztec Data Supply Inc.

USA . 4,248 parts In-Stock

1+ parts

$31.210

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4,248

$31.210

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SupplyDigital Components

Austria . 7,150 parts In-Stock

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Problanco Electronics

Mexico . 6,314 parts In-Stock

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Continental Prestige Electronics

USA . 5,574 parts In-Stock

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5,574

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A-Z Elektronik GmbH

Germany . 4,593 parts In-Stock

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4,593

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Kulean Microsystems

USA . 3,357 parts In-Stock

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3,357

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Argo Parts USA

USA . 2,804 parts In-Stock

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TANS Electronics

Latvia . 2,487 parts In-Stock

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UHIMA Technologies

Türkiye . 849 parts In-Stock

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849

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Aranea Global

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 217 parts In-Stock

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217

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Overview

Upgrade your clock drivers with the NB6L56MNG by Onsemi! As a leading manufacturer in the industry, Onsemi guarantees top-quality products that deliver unparalleled performance. Clock Drivers & Buffers are essential for precision timing applications, and this product offers a propagation delay of just 0.4 ns, ensuring accurate synchronization. With a nominal supply voltage of 2.5V and a wide operating temperature range, the NB6L56MNG is an ideal choice for industrial settings. Trust Onsemi to provide reliable solutions for all your clock driver needs, and experience the value and benefits that this product brings to your projects.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

The low propagation delay of 0.4 ns ensures quick and efficient operation of the clock driver, reducing latency in signal transmission.

Surface Mount

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and facilitating mass production.

Input Conditioning

The use of differential multiplexer input conditioning ensures high signal integrity, minimizing the risk of noise and interference in the signal transmission process.

Nominal Supply Voltage / Vsup (V)

The nominal supply voltage of 2.5V is commonly used in many electronic systems, making this clock driver compatible with a wide range of applications.

Maximum Operating Temperature

The high maximum operating temperature of 85°C allows this clock driver to function reliably in demanding industrial environments without overheating.

Minimum Operating Temperature

The low minimum operating temperature of -40°C ensures the clock driver can operate effectively in cold environments, making it versatile for various applications.

Maximum Time At Peak Reflow Temperature (s)

The maximum time at peak reflow temperature of 30 seconds ensures that the clock driver can withstand the soldering process during assembly without damage.

Temperature Grade

The industrial temperature grade designates this clock driver as suitable for use in rugged industrial environments where temperature fluctuations are common.

Technical Specifications

Clock Drivers & Buffers NB6L56MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.4 ns

Propagation Delay (tpd):

.36 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

2500 MHz

Trade Compliance

NB6L56MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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