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NB6L14SMNTWG

Onsemi

NB6L14SMNTWG by Onsemi

NB6L14SMNTWG clock driver by Onsemi features a low propagation delay of 0.6 ns at 2.5V, suitable for industrial applications. With differential input conditioning and 4 true outputs, this chip carrier package with a square shape is surface mountable and operates b/w -40 to 85°C.

Median Price

$8.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,338 parts In-Stock

1+ parts

$8.300

100+ parts

$5.459

1k+ parts

$4.946

10k+ parts

$4.797

2,338

$8.300

$5.459

$4.946

$4.797

Mouser Electronics

USA . 1,926 parts In-Stock

1+ parts

$8.300

100+ parts

$5.460

1k+ parts

$4.710

10k+ parts

$4.650

1,926

$8.300

$5.460

$4.710

$4.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 404 parts In-Stock

1+ parts

$5.050

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$5.050

-

-

-

Digiode

USA . 291 parts In-Stock

1+ parts

$8.198

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$8.198

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,663 parts In-Stock

1+ parts

$7.340

100+ parts

-

1k+ parts

-

10k+ parts

-

2,663

$7.340

-

-

-

Corphita

USA . 299 parts In-Stock

1+ parts

$7.767

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$7.767

-

-

-

Corohmni

South Africa . 249 parts In-Stock

1+ parts

$8.630

100+ parts

-

1k+ parts

-

10k+ parts

-

249

$8.630

-

-

-

Microchip USA

USA . 3,973 parts In-Stock

1+ parts

$32.180

100+ parts

$31.980

1k+ parts

$31.880

10k+ parts

$31.780

3,973

$32.180

$31.980

$31.880

$31.780

QUARKTWIN TECHNOLOGY LTD

USA . 23,309 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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23,309

-

-

-

-

Problanco Electronics

Mexico . 6,748 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,748

-

-

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

-

100+ parts

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6,000

-

-

-

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Kulean Microsystems

USA . 2,945 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,945

-

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,800

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-

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SupplyDigital Components

Austria . 2,676 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,676

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-

-

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TANS Electronics

Latvia . 2,372 parts In-Stock

1+ parts

-

100+ parts

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2,372

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-

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UHIMA Technologies

Türkiye . 757 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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757

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Overview

Enhance your electronic designs with the NB6L14SMNTWG by Onsemi, a top-quality clock driver and buffer that offers superior performance and reliability. Manufactured by the trusted Onsemi brand, this product is perfect for a wide range of applications in the electronics industry. With its low propagation delay and differential input conditioning, this chip carrier boasts a very thin profile and a durable matte tin finish. Experience seamless integration and precise timing with the NB6L14SMNTWG, providing customers with exceptional value and unmatched benefits for their electronic projects.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures fast and efficient data transmission.

Surface Mount

Easy to mount on circuit boards, saving space and allowing for automated assembly.

Input Conditioning

Differential input conditioning helps in reducing noise and improving signal integrity.

Package Shape

Square package shape provides uniformity in design and easy placement on PCBs.

Nominal Supply Voltage / Vsup (V)

Stable supply voltage ensures consistent performance.

Power Supplies (V)

Matching power supply voltage for reliable operation.

No. of Terminals

Sufficient terminals for connections and functionality.

Package Style (Meter)

Various package styles cater to different application requirements and thermal management needs.

Maximum Operating Temperature

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature

Able to operate in harsh environments with low temperatures.

Terminal Finish

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position

Quad terminal position for stable and secure connections.

Maximum Seated Height

Low seated height allows for compact and slim designs.

Width

Narrow width enables placement in tight spaces.

Minimum Supply Voltage (Vsup)

Wide supply voltage range for flexibility in powering the device.

Maximum Time At Peak Reflow Temperature (s)

Adequate time at peak reflow temperature for reliable soldering during assembly.

Peak Reflow Temperature °C

High peak reflow temperature for robust solder joints.

Length

Compact length for space-saving designs.

Temperature Grade

Industrial-grade temperature rating for reliable performance in harsh conditions.

Terminal Form

No-lead terminal form for environmental sustainability and RoHS compliance.

Terminal Pitch

Fine terminal pitch for high-density mounting and connectivity.

Maximum Same Edge Skew (tskwd)

Low skew ensures accurate timing and synchronization within the circuit.

No. of True Outputs

Multiple true outputs for driving multiple clock signals efficiently.

Maximum Supply Voltage (Vsup)

Maximum supply voltage rating for safe operation within specified limits.

Technical Specifications

Clock Drivers & Buffers NB6L14SMNTWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L14SMNTWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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