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NB6L11SMNG

Onsemi

NB6L11SMNG by Onsemi

NB6L11SMNG by Onsemi is a clock driver with a propagation delay of 0.45 ns and operates at a nominal voltage of 2.5V. It is used in applications requiring differential input conditioning and has a surface mount package style.

Median Price

$10.400

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 3 parts In-Stock

1+ parts

$2.430

100+ parts

$2.430

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$2.430

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3

$2.430

$2.430

$2.430

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Arrow

USA . 37 parts In-Stock

1+ parts

$7.092

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37

$7.092

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Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$10.400

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8

$10.400

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Farnell

UK . 95 parts In-Stock

1+ parts

$10.490

100+ parts

$5.310

1k+ parts

$5.290

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95

$10.490

$5.310

$5.290

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Mouser Electronics

USA . 818 parts In-Stock

1+ parts

$11.380

100+ parts

$7.480

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$6.900

10k+ parts

$6.550

818

$11.380

$7.480

$6.900

$6.550

Element14

Singapore . 6 parts In-Stock

1+ parts

$891.420

100+ parts

$620.840

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$599.260

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6

$891.420

$620.840

$599.260

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Verical

USA . 2,829 parts In-Stock

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-

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$6.396

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2,829

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$6.396

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Flip Electronics (Authorized)

USA . 246 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 195 parts In-Stock

1+ parts

$6.737

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-

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195

$6.737

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Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$7.810

100+ parts

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32

$7.810

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Flip Electronics

USA . 2,829 parts In-Stock

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2,829

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Chip Stock

USA . 393 parts In-Stock

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Vyrian

USA . 130 parts In-Stock

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Prism Electronics

USA . 37 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 149 parts In-Stock

1+ parts

$6.030

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149

$6.030

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Semicontronic

India . 141 parts In-Stock

1+ parts

$6.030

100+ parts

$5.879

1k+ parts

$5.849

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141

$6.030

$5.879

$5.849

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Corphita

USA . 1,012 parts In-Stock

1+ parts

$6.383

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1,012

$6.383

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Corohmni

South Africa . 226 parts In-Stock

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$7.092

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226

$7.092

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Netroflash

USA . 100 parts In-Stock

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$7.810

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100

$7.810

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$7.966

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$7.966

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$7.966

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500

$7.966

$7.966

$7.966

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Continental Prestige Electronics

USA . 10 parts In-Stock

1+ parts

$9.880

100+ parts

$6.910

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10

$9.880

$6.910

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Aztec Data Supply Inc.

USA . 581 parts In-Stock

1+ parts

$22.943

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581

$22.943

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Microchip USA

USA . 944 parts In-Stock

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$31.696

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944

$31.696

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Lixinc

USA . 9,210 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,557 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 3,539 parts In-Stock

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Problanco Electronics

Mexico . 2,637 parts In-Stock

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Kulean Microsystems

USA . 2,546 parts In-Stock

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Perfect Parts

USA . 1,056 parts In-Stock

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TANS Electronics

Latvia . 775 parts In-Stock

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SupplyDigital Components

Austria . 237 parts In-Stock

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Kepictronics

USA . 95 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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UHIMA Technologies

Türkiye . 42 parts In-Stock

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Overview

Discover the NB6L11SMNG by Onsemi, a high-quality clock driver and buffer that offers exceptional performance and reliability. As a trusted manufacturer, Onsemi brings years of expertise to this product, ensuring it meets the highest standards. Ideal for various applications, this chip carrier with a very thin profile provides differential input conditioning and boasts a propagation delay of just 0.45 ns. With its compact size and wide temperature range, the NB6L11SMNG is perfect for industrial use. Experience the value and benefits this product offers, including precise timing, efficient power management, and seamless integration. Elevate your designs with the advantages of the NB6L11SMNG and unleash the full potential of your projects.

Feature Benefit Bullets

Propagation Delay:

0.45 ns - This clock driver and buffer has a very low propagation delay, ensuring efficient and fast signal transmission, making it an excellent choice for high-speed applications.

Surface Mount:

YES - With a surface mount option, this product offers easy and convenient installation, allowing for space-saving and versatile implementation in various circuit designs.

Input Conditioning:

DIFFERENTIAL - The input conditioning being differential enhances noise immunity and signal integrity, making this clock driver and buffer suitable for applications where robust and reliable performance is needed.

No. of Functions:

1 - This clock driver and buffer features a single function, simplifying circuit design and minimizing complexity.

Package Shape:

SQUARE - The square package shape offers a compact and efficient form factor, allowing for optimized space utilization in electronic systems.

Nominal Supply Voltage (Vsup):

2.5 V - With a nominal supply voltage of 2.5V, this product provides a suitable power input range for a wide range of applications, ensuring compatibility with many voltage standards.

Power Supplies (V):

2.5 V - The availability of power supplies at 2.5V ensures consistent and stable power delivery, contributing to the reliable operation of this clock driver and buffer.

No. of Terminals:

16 - With 16 terminals, this clock driver and buffer offers sufficient connectivity options for interfacing with other devices and components, facilitating versatile integration within circuit designs.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - The chip carrier-style package, including a heat sink/slug, along with a very thin profile, provides excellent thermal management and helps dissipate heat efficiently, ensuring optimal performance and reliability.

Propagation Delay (tpd):

0.45 ns - The low propagation delay ensures minimal delay in signal transmission, maintaining precise timing requirements in high-speed applications.

Maximum Operating Temperature:

85 °C - With a maximum operating temperature of 85°C, this clock driver and buffer can withstand high-temperature environments, enhancing its suitability for industrial applications.

Minimum Operating Temperature:

40 °C - The clock driver and buffer can operate reliably even in extremely low-temperature conditions, making it suitable for a wide range of environments and applications.

Terminal Finish:

NICKEL GOLD PALLADIUM - The terminal finish of nickel gold palladium offers excellent electrical conductivity and corrosion resistance, ensuring long-term durability and stable performance of this clock driver and buffer.

Terminal Position:

QUAD - With a quad terminal position, this clock driver and buffer enables easy and secure connection, enhancing the overall reliability and stability of the circuit system.

Maximum Seated Height:

1 mm - The clock driver and buffer's low maximum seated height allows for compact integration, making it ideal for space-constrained applications.

Width:

3 mm - With a width of 3 mm, this clock driver and buffer offers a compact form factor and can be easily integrated into various circuit designs.

Minimum Supply Voltage (Vsup):

2.375 V - The minimum supply voltage of 2.375V ensures compatibility with lower voltage requirements, providing flexibility in power input options.

Maximum Time At Peak Reflow Temperature (s):

30 - This clock driver and buffer can withstand a maximum time of 30 seconds at the peak reflow temperature, allowing for reliable soldering during manufacturing processes.

Peak Reflow Temperature °C:

260 - The clock driver and buffer's peak reflow temperature of 260°C ensures secure and robust soldering connections, contributing to the overall reliability and longevity of the product.

Length:

3 mm - With a length of 3 mm, this clock driver and buffer offers a compact and space-saving solution, ideal for applications with limited board space.

Temperature Grade:

INDUSTRIAL - Designed for industrial environments, this clock driver and buffer can withstand harsh operating conditions, making it suitable for demanding applications.

Terminal Form:

NO LEAD - The no-lead terminal form improves reliability and simplifies assembly, ensuring a more efficient and environmentally friendly manufacturing process.

Terminal Pitch:

0.5 mm - With a terminal pitch of 0.5 mm, this clock driver and buffer allows for precise and secure connections between the device and the circuit, ensuring reliable and stable signal transmission.

Maximum Same Edge Skew (tskwd):

0.025 ns - The clock driver and buffer's low maximum same edge skew ensures minimal skewing between signals, maintaining accurate timing and synchronization in multi-channel applications.

No. of True Outputs:

2 - With two true outputs, this clock driver and buffer offers multiple output options, providing flexibility and versatility in signal distribution.

Moisture Sensitivity Level (MSL):

1 - The moisture sensitivity level of 1 ensures that this clock driver and buffer is less susceptible to moisture-induced damage during storage and handling, ensuring its reliability and long lifespan.

Maximum Supply Voltage (Vsup):

2.625 V - With a maximum supply voltage of 2.625V, this clock driver and buffer accommodates higher voltage requirements, making it compatible with a broader range of applications.

Technical Specifications

Clock Drivers & Buffers NB6L11SMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

.45 ns

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L11SMNG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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