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NB2305AI1DR2G

Onsemi

NB2305AI1DR2G by Onsemi

NB2305AI1DR2G clock driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.33MHz. It is ideal for industrial applications requiring precise timing synchronization in a compact small outline package. With standard input conditioning and dual terminal position, it ensures reliable performance in temperature ranges from -40 to 85°C.

Median Price

$0.645

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$0.421

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$0.421

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Chip1Stop

Japan . 1 parts In-Stock

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$0.645

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1

$0.645

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Rochester

USA . 2,528 parts In-Stock

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$0.810

100+ parts

$0.790

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$0.780

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2,528

$0.810

$0.790

$0.780

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Distributors (In-Stock)

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Digiode

USA . 668 parts In-Stock

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$0.396

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$0.396

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Nova Conductors

Japan . 100 parts In-Stock

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$0.528

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100

$0.528

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Chip Stock

USA . 3,790 parts In-Stock

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3,790

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Vyrian

USA . 1,918 parts In-Stock

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Bristol Electronics

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LWI Electronics Inc

India . 4 parts In-Stock

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Semicontronic

India . 540 parts In-Stock

1+ parts

$0.354

100+ parts

$0.345

1k+ parts

$0.343

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540

$0.354

$0.345

$0.343

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Corphita

USA . 2,106 parts In-Stock

1+ parts

$0.375

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$0.375

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Corohmni

South Africa . 246 parts In-Stock

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$0.417

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Continental Prestige Electronics

USA . 3,816 parts In-Stock

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$0.528

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$0.517

3,816

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$0.517

Argo Parts USA

USA . 555 parts In-Stock

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$0.528

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$0.512

555

$0.528

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$0.512

Ampacity Inc.

Singapore . 593 parts In-Stock

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$0.770

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$0.770

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AZTECH Wire

Italy . 949 parts In-Stock

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$18.590

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Aztec Data Supply Inc.

USA . 3,466 parts In-Stock

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$30.730

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

Mexico . 5,669 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 4,830 parts In-Stock

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Kulean Microsystems

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Metaverse IC Inc.

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Lixinc

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TANS Electronics

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SupplyDigital Components

Austria . 239 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 6 parts In-Stock

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Overview

Elevate your clock driver and buffer needs with the NB2305AI1DR2G by Onsemi. This high-quality product offers unparalleled reliability and performance, thanks to its innovative design and cutting-edge technology. Ideal for a range of applications in various industries, this clock driver ensures seamless operation and precise timing. Experience the value and benefits of this top-of-the-line product, designed to meet your specific requirements and exceed your expectations. Trust Onsemi for all your clock driver needs and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, ensuring compatibility with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Can function in cold environments, offering versatility in different operating conditions.

Technology: CMOS

Utilizes CMOS technology known for low power consumption and high noise immunity, enhancing efficiency.

Maximum Same Edge Skew (tskwd): 0.25 ns

Provides precise timing synchronization, ensuring accurate clock signals for synchronous operations.

Technical Specifications

Clock Drivers & Buffers NB2305AI1DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

133.33 MHz

Trade Compliance

NB2305AI1DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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