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MC100LVEL11DG

Onsemi

MC100LVEL11DG by Onsemi

MC100LVEL11DG clock driver by Onsemi offers 0.405 ns propagation delay, 2 true outputs at 1000 MHz. Ideal for industrial applications with a temperature range of -40 to 85 °C, differential input conditioning, and small outline package style.

Median Price

$2.844

Lifecycle Status

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24

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1k+

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Chip1Stop

Japan . 13 parts In-Stock

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$3.360

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Mouser Electronics

USA . 249 parts In-Stock

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$4.770

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$2.910

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$2.570

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$2.500

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Verical

USA . 9,506 parts In-Stock

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Rochester

USA . 4,226 parts In-Stock

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Arrow

USA . 588 parts In-Stock

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DigiKey

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Avnet

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Digiode

USA . 2,466 parts In-Stock

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$2.194

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Chip Stock

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Flip Electronics

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Vyrian

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Sensible Micro Corp

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NAC Semi

USA . 588 parts In-Stock

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DigiKey Marketplace

USA . 353 parts In-Stock

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$2.810

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Bristol Electronics

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LIBRA Elektronik GmbH

Germany . 87 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Prism Electronics

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Flex Direct, LLC

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Inventory MP

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Semi Source

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Connector Distribution Corp

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Right Parts Inc.

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Speed Components Ltd

Israel . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,472 parts In-Stock

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$2.079

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Corohmni

South Africa . 65 parts In-Stock

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$2.170

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Ampacity Inc.

Singapore . 664 parts In-Stock

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$2.290

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Semicontronic

India . 619 parts In-Stock

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$2.290

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$2.233

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$2.221

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Component Stockers USA

USA . 3,727 parts In-Stock

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$2.750

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$2.580

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$2.340

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Microchip USA

USA . 1,899 parts In-Stock

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$18.270

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$18.150

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$18.100

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$18.040

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Aztec Data Supply Inc.

USA . 2,054 parts In-Stock

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Modulus Dynamics

Lithuania . 2,919 parts In-Stock

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Lixinc

USA . 9,239 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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Argo Parts USA

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Perfect Parts

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Problanco Electronics

Mexico . 802 parts In-Stock

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Continental Prestige Electronics

USA . 353 parts In-Stock

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UHIMA Technologies

Türkiye . 201 parts In-Stock

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Eastek

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Futuretech Components

Singapore . 144 parts In-Stock

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GreenTree Electronics

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Overview

Experience superior clock signal management with the MC100LVEL11DG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Clock Drivers & Buffers that provide precise and efficient signal processing for your applications. With a fast propagation delay and differential input conditioning, this product ensures optimal performance. Trust Onsemi to deliver reliable products that offer value, benefits, and advantages to meet your needs. Elevate your designs with the MC100LVEL11DG and experience unparalleled quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring long-lasting performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common voltage level makes it compatible with a wide range of systems and applications.

Propagation Delay At Nominal Supply: 0.435 ns

Fast propagation delay ensures quick signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with a wide temperature range, ensuring consistent performance in harsh conditions.

Technical Specifications

Clock Drivers & Buffers MC100LVEL11DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.435 ns

Propagation Delay (tpd):

.405 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

1000 MHz

Trade Compliance

MC100LVEL11DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-591-7614, 5962015917614

NIIN

015917614

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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