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LMK00301SQX/NOPB

Texas Instruments

LMK00301SQX/NOPB by Texas Instruments

LMK00301SQX/NOPB clock driver by Texas Instruments operates at 3.3V, with a propagation delay of 2.7ns and 48 terminals in a square package shape. Ideal for industrial applications requiring precise timing synchronization and differential multiplexing capabilities.

Median Price

$7.498

Lifecycle Status

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6

In-Stock Inventory

1k+

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Texas Instruments

USA . 9,365 parts In-Stock

1+ parts

$5.336

100+ parts

$4.350

1k+ parts

$2.900

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-

9,365

$5.336

$4.350

$2.900

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Mouser Electronics

USA . 1,226 parts In-Stock

1+ parts

$9.660

100+ parts

$6.000

1k+ parts

$4.620

10k+ parts

$4.470

1,226

$9.660

$6.000

$4.620

$4.470

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$4.151

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550

$4.151

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Digiode

USA . 2,984 parts In-Stock

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$5.069

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2,984

$5.069

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Chip Stock

USA . 27,620 parts In-Stock

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Vyrian

USA . 4,728 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,714 parts In-Stock

1+ parts

$4.151

100+ parts

-

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$4.068

4,714

$4.151

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-

$4.068

Argo Parts USA

USA . 2,531 parts In-Stock

1+ parts

$4.151

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2,531

$4.151

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Ampacity Inc.

Singapore . 4,363 parts In-Stock

1+ parts

$4.540

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4,363

$4.540

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Andel Nordic

Denmark . 895 parts In-Stock

1+ parts

$4.733

100+ parts

-

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$4.544

10k+ parts

$4.544

895

$4.733

-

$4.544

$4.544

Corphita

USA . 1,014 parts In-Stock

1+ parts

$4.802

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1,014

$4.802

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Parana Technologies

USA . 1,370 parts In-Stock

1+ parts

$12.854

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$13.331

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1,370

$12.854

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$13.331

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DigiPath Technology Company

USA . 77 parts In-Stock

1+ parts

$14.154

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77

$14.154

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ChromeModa Solutions

Germany . 2,402 parts In-Stock

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$14.443

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$11.843

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2,402

$14.443

$11.843

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IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$14.443

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$13.721

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$12.999

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610

$14.443

$13.721

$12.999

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QUARKTWIN TECHNOLOGY LTD

USA . 14,310 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Lixinc

USA . 9,989 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,256 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,504 parts In-Stock

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Kepictronics

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Netroflash

USA . 1,000 parts In-Stock

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$3.943

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$3.860

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$3.860

Perfect Parts

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GreenTree Electronics

Israel . 422 parts In-Stock

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Overview

Experience the unmatched precision and reliability of Texas Instruments with the LMK00301SQX/NOPB clock driver & buffer. This high-quality product boasts a SQUARE package shape, 3-STATE output characteristics, and a wide temperature range for industrial applications. With a fast propagation delay of 2.7 ns and 20 true outputs operating at up to 400 MHz, this chip carrier offers unparalleled performance. Trust in Texas Instruments to deliver cutting-edge technology that meets your exacting standards.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient PCB assembly, making it a convenient choice for manufacturers.

Input Conditioning: DIFFERENTIAL MUX

The differential MUX input conditioning provides accurate signal processing, ensuring reliable performance.

Package Shape: SQUARE

The square package shape aids in space-saving on the PCB, making it ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, offering compatibility with various applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient power management and consistent operation.

No. of Terminals: 48

With 48 terminals, this product offers versatile connectivity options for different configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style provides optimal thermal management and space utilization.

Propagation Delay (tpd): 2.7 ns

The low propagation delay of 2.7 ns enhances the speed and efficiency of signal transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in various environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signals, enhancing versatility in applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable operation even in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides corrosion resistance and ensures a secure electrical connection.

Terminal Position: QUAD

The quad terminal position simplifies the installation process and promotes ease of use.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm enables a compact and slim design, suitable for space-constrained applications.

Width: 7 mm

The 7 mm width offers compatibility with standard PCB layouts and enhances integration flexibility.

Minimum Supply Voltage (Vsup): 3.15 V

The minimum supply voltage of 3.15V ensures reliable operation even under low power conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for robust soldering during the manufacturing process.

Length: 7 mm

The 7 mm length contributes to a compact form factor, ideal for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures stable performance in harsh industrial environments.

Terminal Form: NO LEAD

The no lead terminal form reduces environmental impact and complies with current industry regulations.

Packing Method: TR

The TR packing method offers secure and organized storage, facilitating efficient inventory management.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise connections and compact PCB layout designs.

Maximum Same Edge Skew (tskwd): 0.05 ns

The low maximum same edge skew of 0.05 ns ensures uniform signal timing, enhancing overall system performance.

No. of True Outputs: 20

With 20 true outputs, this product can support multiple output signals, making it suitable for complex applications.

Minimum fmax: 400 MHz

The minimum fmax of 400 MHz ensures high-speed operation, making it suitable for applications requiring fast signal processing.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of moisture sensitivity, ensuring proper handling and storage practices to prevent damage.

Maximum Supply Voltage (Vsup): 3.45 V

The maximum supply voltage of 3.45V provides a safe operating range and protects the device from overvoltage conditions.

Maximum Power Supply Current (ICC): 13.5 mA

The maximum power supply current of 13.5 mA ensures efficient power consumption and prolongs the operational lifespan of the product.

Technical Specifications

Clock Drivers & Buffers LMK00301SQX/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

00301

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

13.5 mA

Propagation Delay (tpd):

2.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Minimum fmax:

400 MHz

Trade Compliance

LMK00301SQX/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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