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ZL40226LDF1

Microchip Technology

ZL40226LDF1 by Microchip Technology

ZL40226LDF1 by Microchip Tech is a Clock Driver with 2ns Propagation Delay, 32 Terminals, and 16 True Outputs. It operates in Industrial Temperature range (-40 to 85°C) and supports Differential Mux input conditioning. Ideal for applications requiring precise clock signal distribution in compact spaces.

Median Price

$9.219

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.219

100+ parts

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500

$9.219

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Vyrian

USA . 225 parts In-Stock

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225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,884 parts In-Stock

1+ parts

$4.363

100+ parts

-

1k+ parts

$4.188

10k+ parts

$4.188

1,884

$4.363

-

$4.188

$4.188

Ampacity Inc.

Singapore . 541 parts In-Stock

1+ parts

$8.000

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541

$8.000

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Continental Prestige Electronics

USA . 1,667 parts In-Stock

1+ parts

$9.219

100+ parts

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$9.035

1,667

$9.219

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$9.035

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$9.219

100+ parts

-

1k+ parts

$8.758

10k+ parts

$8.574

1,000

$9.219

-

$8.758

$8.574

AZTECH Wire

Italy . 616 parts In-Stock

1+ parts

$16.822

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616

$16.822

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Argo Parts USA

USA . 2,530 parts In-Stock

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2,530

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Marpe Global Electronics

Taiwan . 2,282 parts In-Stock

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QualityLine Systems

Poland . 2,282 parts In-Stock

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XL Components Corporation

Australia . 2,282 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your clock driver and buffer game with the ZL40226LDF1 from Microchip Technology. This high-quality product offers unmatched reliability and performance in a compact, easy-to-install package. Perfect for a wide range of applications, this clock driver excels in delivering differential mux input conditioning with minimal propagation delay. With a nominal supply voltage of 2.5V and industrial-grade temperature specifications, this chip carrier is designed to exceed expectations. Upgrade your setup today and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product suitable for compact electronic devices.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning ensures reliable signal processing and high noise immunity, making this product ideal for applications where signal integrity is crucial.

Package Shape: SQUARE

Square package shape contributes to easier PCB layout and better utilization of board space, enhancing overall system efficiency.

Nominal Supply Voltage (Vsup): 2.5V

Stable supply voltage of 2.5V ensures consistent performance and compatibility with various digital systems that operate within this voltage range.

Propagation Delay (tpd): 2 ns

Low propagation delay of 2 ns results in fast signal processing and reduced latency, making this product suitable for high-speed clock distribution applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is designed to withstand industrial environments and extended operation under high temperature conditions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style featuring a chip carrier, heat sink/slug, and very thin profile enhances thermal performance, reliability, and space efficiency, making this product a reliable choice for compact and heat-sensitive applications.

No. of True Outputs: 16

Having 16 true outputs allows for versatile clock signal distribution and connectivity, making this product suitable for multi-channel clocking applications.

Technical Specifications

Clock Drivers & Buffers ZL40226LDF1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Propagation Delay (tpd):

2 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ZL40226LDF1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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